Copper-nickel alloy electroplating device

A copper-nickel alloy electroplating apparatus, comprising:

• a cathode chamber in which a workpiece is to be placed;
• a plating liquid in the cathode chamber;
• an anode chamber;
• an anode placed in the anode chamber;
• a plating liquid in the anode chamber;
• an electrically conductive diaphragm placed to separate the cathode chamber and the anode chamber from each other;
• a cathode chamber oxidation-reduction potential adjusting tank for adjusting the oxidation-reduction potential of the plating liquid in the cathode chamber;
• an anode chamber oxidation-reduction potential adjusting tank for adjusting the oxidation-reduction potential of the plating liquid in the anode chamber;
• a power supply unit that provides an electric current to flow between the workpiece and the anode;
• a cathode chamber electric potential measuring device that measures the oxidation-reduction potential of the plating liquid in the cathode chamber;
• an anode chamber electric potential measuring device that measures the oxidation-reduction potential of the plating liquid in the anode chamber;
• an oxidation-reduction potential adjusting agent in a cathode chamber adjusting agent addition device that adds the oxidation-reduction potential adjusting agent to the cathode chamber oxidation-reduction potential adjusting tank;
• an oxidation-reduction potential adjusting agent in an anode chamber adjusting agent addition device that adds the oxidation-reduction potential adjusting agent to the anode chamber oxidation-reduction potential adjusting tank;
• and
• a control unit that controls the cathode chamber adjusting agent addition device and the anode chamber adjusting agent addition device on the basis of the oxidation-reduction potential measured by the cathode chamber electric potential measuring device and the oxidation-reduction potential measured by the anode chamber electric potential measuring device;
• wherein the plating liquid in the cathode chamber does not comprise the oxidation-reduction potential adjusting agent prior to adding the oxidation-reduction potential adjusting agent to the cathode chamber oxidation-reduction potential adjusting tank;
• and
• wherein the plating liquid in the anode chamber does not comprise the oxidation-reduction potential adjusting agent prior to adding the oxidation-reduction potential adjusting agent to the anode chamber oxidation-reduction potential adjusting tank.