Sputtering target for forming protective film, and laminated wiring film

A backing plate-attached sputtering target for forming a protective film, which is used to form a protective film on one or both surfaces of a Cu wiring film,

• the backing plate-attached target comprising a backing plate and a sputtering target that is soldered on the backing plate by using indium,
• the sputtering target consisting of:
• Ni:
• 5.0 to 15.0% by mass,
• Mn:
• 2.0 to 10.0% by mass,
• Zn:
• 30.1% to 50.0% by mass,
• Al:
• 2.0 to 4.5% by mass, and
• the remainder composed of Cu and inevitable impurities,
• wherein the sputtering target is produced by hot rolling and cold rolling an ingot consisting of Ni:
• 5.0 to 15.0% by mass, Mn:
• 2.0 to 10.0% by mass, Zn:
• 30.1% to 50.0% by mass, Al:
• 2.0 to 4.5% by mass, and the remainder composed of Cu and inevitable impurities.