Polishing method and polishing apparatus

A polishing apparatus comprising:

• a turntable which is driven to rotate by a motor and has a refrigerant flow path provided therein;
• a polishing pad attached to the turntable;
• and holding means for holding a wafer, the apparatus being configured to rub the wafer held by the holding means against the polishing pad attached to the turntable while cooling the turntable by supplying a refrigerant to the refrigerant flow path, thereby performing polishing of the water,
• wherein the apparatus comprises:
• a flow volume adjusting valve which controls a flow volume of the refrigerant supplied to the refrigerant flow path in the turntable;
• a turntable control unit which controls rotation of the turntable;
• and
• a water retaining liquid supply mechanism which supplies a water retaining liquid to retain water in the polishing pad to the polishing pad during standby after end of the polishing of the wafer and before the polishing of a next wafer,
• the flow volume adjusting valve controls a flow volume of the refrigerant during the standby to be less than a flow volume of the refrigerant during the polishing where the wafer is polished,
• the turntable control unit rotates the turntable by the motor even during the standby, and
• the water retaining liquid supply mechanism supplies the water retaining liquid having a temperature adjusted to a room temperature or more to the polishing pad during the standby.