Drilling device and method for adjusting cutting operational parameters during drilling of a multilayer element
AssigneeSeti-Tec
InventorSebastien Pereira
Life of this patent
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AssigneeSeti-Tec
InventorSebastien Pereira
Estimating the term…
A method for drilling an element to be drilled by a drilling device and a cutting tool including drill margins and cutting edges. The method includes determining at least one load value representing overall drag due to internal friction of the drilling device and to friction of drill margins in the element to be drilled. Determining includes: stopping a drilling operation in progress; partial retraction of the cutting tool on a predetermined distance, the predetermined distance being chosen such that the cutting edges are no longer in contact with the element to be drilled; driving the cutting tool with predetermined cutting parameters; measuring at least one load value during the driving of the cutting tool with the cutting parameters before its cutting edges again come into contact with the element to be drilled and after stabilization of the load values, the measured load value representing the overall drag.
A method for drilling an element to be drilled by using a drilling device and a cutting tool comprising drill margins and cutting edges, said method comprising:
A drilling device that is to be implemented to carry out at least one operation for drilling an element to be drilled by using a cutting tool comprising drill margins and cutting edges, said device comprising:
Dependencies are inferred from the claim text.