Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches

A method for fabricating a layer structure constituted by a dielectric film containing a Si—N bond in a trench formed in an upper surface of a substrate, comprising:

• (i) simultaneously forming a dielectric film containing a Si—N bond on the upper surface and a bottom surface and sidewalls of the trench, wherein a top/bottom portion of the dielectric film formed on the upper surface and the bottom surface and a sidewall portion of the dielectric film formed on the sidewalls are given different chemical resistance properties by bombardment of a plasma excited by applying voltage in a reaction space between two electrodes between which the substrate is placed in parallel to the two electrodes;
• (ii) substantially removing either one of but not both of the top/bottom portion and the sidewall portion of the dielectric film by etching which removes the one of the top/bottom portion and the sidewall portion of the dielectric film more predominantly than the other according to the different chemical resistance properties;
• and
• (iii) obtaining a reference plasma density at which the chemical resistance properties of the top/bottom portion of the dielectric film and the sidewall portion of the dielectric film are substantially equivalent,
• wherein the plasma in step (i) is a capacitively coupled plasma (CCP) which is excited by applying RF power to one of the two electrodes, wherein plasma density is higher than the reference plasma density,
• wherein the etching in step (ii) removes the top/bottom portion of the dielectric film selectively relative to the sidewall portion of the dielectric film, wherein obtaining the reference plasma density comprises performing the forming of dielectric films as recited in step (i), then determining the chemical resistance property by etching as recited in step (ii), then repeating these steps for a plurality of times using different plasma density values, then obtaining the reference plasma density at which the chemical resistance properties of the top/bottom portion of the dielectric film and the sidewall portion of the dielectric film are substantially equivalent, wherein the plasma density is modulated by tuning the pressure in the reaction space, wherein the plasma density increases by lowering the pressure.

A method for fabricating a layer structure constituted by a dielectric film containing a Si—N bond in a trench formed in an upper surface of a substrate, comprising:

• (i) simultaneously forming a dielectric film containing a Si—N bond on the upper surface and a bottom surface and sidewalls of the trench, wherein a top/bottom portion of the dielectric film formed on the upper surface and the bottom surface and a sidewall portion of the dielectric film formed on the sidewalls are given different chemical resistance properties by bombardment of a plasma excited by applying voltage in a reaction space between two electrodes between which the substrate is placed in parallel to the two electrodes;
• (ii) substantially removing either one of but not both of the top/bottom portion and the sidewall portion of the dielectric film by etching which removes the one of the top/bottom portion and the sidewall portion of the dielectric film more predominantly than the other according to the different chemical resistance properties;
• and
• (iii) obtaining a reference plasma density at which the chemical resistance properties of the top/bottom portion of the dielectric film and the sidewall portion of the dielectric film are substantially equivalent,
• wherein the plasma in step (i) is a capacitively coupled plasma (CCP) which is excited by applying RF power to one of the two electrodes, wherein plasma density is higher than the reference plasma density,
• wherein the etching in step (ii) removes the top/bottom portion of the dielectric film selectively relative to the sidewall portion of the dielectric film, wherein obtaining the reference plasma density comprises performing the forming of dielectric films as recited in step (i), then determining the chemical resistance property by etching as recited in step (ii), then repeating these steps for a plurality of times using different plasma density values, then obtaining the reference ion plasma density at which the chemical resistance properties of the top/bottom portion of the dielectric film and the sidewall portion of the dielectric film are substantially equivalent, wherein the plasma density is modulated by tuning a ratio of high frequency RF power to low frequency RF power constituting the RF power, wherein the plasma density increases by decreasing the ratio, wherein the high-frequency RF power has a frequency of 1 MHz or higher and the low-frequency RF power has a frequency of less than 1 MHz.