Devices, methods, and systems for thermal management

A heat transfer device comprising:

• a substantially continuous first surface wall forming a bottom side of the heat transfer device;
• a hermetic first chamber of a first design, wherein the first surface wall provides a bottom wall of the first chamber;
• a hermetic second chamber of a second design different from the first design, positioned adjacent to the first chamber along a length of the first surface wall, wherein the first surface wall provides a bottom wall of the second chamber;
• a first side wall portion of the first chamber, wherein the first side wall portion is directly attached to the first surface wall;
• a second side wall portion of the second chamber, wherein the second side wall portion is directly attached to the first surface wall and adjacent to the first side wall portion of the first chamber;
• and
• a thermally insulating chamber disposed between the first side wall portion and the second side wall portion, the thermally insulating chamber being hermetically sealed with a full or partial vacuum maintained within the thermally insulating chamber
• a first heat transfer medium disposed in the first chamber;
• a first wick disposed in the first chamber and arranged to transport a liquid phase of the first heat transfer medium by capillary forces to an evaporator region of the first chamber;
• a second heat transfer medium disposed in the second chamber;
• and
• a second wick disposed in the second chamber and arranged to transport a liquid phase of the second heat transfer medium by capillary forces to an evaporator region of the second chamber.