Grinding apparatus

Grinding apparatus comprising:

• a turntable;
• a plurality of chuck tables that are disposed on the turntable at equal angles in a circumferential direction, with a rotational axial center of the turntable being a center, and are rotatable;
• first grinding means to which a first grinding wheel having a plurality of first grinding abrasives disposed in a ring manner is rotatably mounted, the first grinding means executing infeed grinding of a wafer in such a manner that the first grinding abrasives are brought into contact with the wafer in a radius range of the wafer held by the chuck table;
• first grinding feed means that executes grinding feed of the first grinding means in a grinding feed direction in which the first grinding means gets closer to or further away from the chuck table;
• second grinding means to which a second grinding wheel having a plurality of second grinding abrasives disposed in a ring manner is rotatably mounted, the second grinding means executing infeed grinding of a wafer in such a manner that the second grinding abrasives are brought into contact with the wafer in a radius range of the wafer held by the chuck table;
• and
• second grinding feed means that executes grinding feed of the second grinding means in the grinding feed direction in which the second grinding means gets closer to or further away from the chuck table,
• wherein the first grinding feed means includes a pair of first guides that are parallel to the grinding feed direction and are disposed to sandwich the first grinding means and a first advancing-retreating shaft that causes the first grinding means whose direction is defined by the first guides to advance and retreat in the grinding feed direction,
• the second grinding feed means includes a pair of second guides that are parallel to the grinding feed direction and are disposed to sandwich the second grinding means and a second advancing-retreating shaft that causes the second grinding means whose direction is defined by the second guides to advance and retreat in the grinding feed direction,
• a first grinding area in which the first grinding means grinds the wafer held by the chuck table has a circular arc shape that has a width of the first grinding abrasives and is centered at a center of the first grinding wheel, and one end of the first grinding area is positioned at outer circumference of the wafer and the other end is positioned at a center of the wafer,
• a second grinding area in which the second grinding means grinds the wafer held by the chuck table has a circular arc shape that has a width of the second grinding abrasives and is centered at a center of the second grinding wheel, and one end of the second grinding area is positioned at outer circumference of the wafer and the other end is positioned at a center of the wafer,
• a centroid of the first grinding area is disposed on a first reference line that couples axial centers of the pair of first guides, and a chord that couples the one end and the other end of the first grinding area and the first reference line are disposed to be orthogonal to each other,
• a centroid of the second grinding area is disposed on a second reference line that couples axial centers of the pair of second guides, and a chord that couples the one end and the other end of the second grinding area and the second reference line are disposed to be orthogonal to each other, and
• the first reference line of the first grinding feed means and the second reference line of the second grinding feed means are disposed at symmetrical positions with respect to the rotational axial center of the turntable.