Dew resistant module for test socket and electronic component testing device having the same

A dew resistant module for an electronic component testing device comprising a test socket and a thermal head provided on the test socket, the test socket having a chip slot for receiving an electronic component, the thermal head regulates the temperature of the electronic component disposed within the test socket, the module comprising:

• an enclosure body circumscribing the test socket;
• a test socket base plate provided on top of the test socket and the enclosure body, the test socket base plate having at least a dry air inlet and a through hole in alignment with the chip slot of the test socket;
• and
• a cover covering at least a portion of the test socket, the enclosure body and the test socket base plate;
• the cover having an opening through which the thermal head passes to abut the electronic component on the test socket;
• wherein the enclosure body and the cover are formed of a material having cushioning and thermal insulation properties;
• wherein the thermal head, the cover, the test socket base plate, and the chip slot of the test socket form an internal chamber, and the dry air inlet of the test socket base plate is in communication with the internal chamber at one end and with a dry air supply source at the other end.