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US 10,520,259 B2Granted
Memory module cooler with rotatable cooling tube
AssigneeHewlett Packard Enterprise Development LP
InventorDavid Scott Chialastri
Life of this patent
Estimating the term…
Abstract
An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.
Claims17
An apparatus to cool memory modules of a computing device, comprising:
- a first liquid manifold;
- a second liquid manifold;
- a cooling tube connected to the first and second liquid manifolds such that:
- liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold;
- and
- the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube,
- wherein the cooling tube has an oblong cross-sectional profile and is configured such that, when the apparatus is installed in the computing device, the cooling tube extends between two of the memory modules and is rotatable relative to the first and second liquid manifolds around the longitudinal axis of the cooling tube between a first configuration and a second configuration, and
- wherein in the first configuration the cooling tube does not touch the memory modules and in the second configuration the cooling tube touches both of the memory modules.
5 more elements
A computing device comprising, comprising:
- a plurality of memory modules connected to a printed circuit board;
- a first liquid manifold;
- a second liquid manifold;
- a plurality of cooling tubes connected to the first and second liquid manifolds such that for each of the plurality of cooling tubes:
- liquid coolant can flow from the first liquid manifold through the respective cooling tube to the second liquid manifold;
- and
- the respective cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the respective cooling tube,
- wherein each of the plurality of cooling tubes:
- is arranged between a corresponding pair of memory modules of the plurality of memory modules, has an oblong cross-sectional profile, and is thermally conductive and semi-rigid, and
- for each of the plurality of cooling tubes:
- the respective cooling tube is rotatable relative to the first and second liquid manifolds around its longitudinal axis between a first configuration and a second configuration,
- in the first configuration the respective cooling tube does not touch its corresponding memory modules and in the second configuration the cooling tube touches both of its corresponding memory modules.
9 more elements
A method of manufacturing a computing device, comprising:
- providing a printed circuit board that includes a number of memory sockets;
- providing a memory module cooler that includes a first liquid manifold, a second liquid manifold, and a number of cooling tubes that have oblong cross-sectional profiles and are connected to the first and second liquid manifolds such that:
- liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold;
- and
- the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube between a first configuration and a second configuration,
- installing the memory module cooler on the printed circuit board by:
- positioning the memory module cooler such that each of the cooling tubes is adjacent to and extends substantially parallel to at least one of the memory sockets;
- and
- affixing the first and second liquid manifolds to the printed circuit board;
- and
- in a state in which the memory module cooler has been installed on the printed circuit board and a number of memory modules have been installed in the memory sockets, rotating the cooling tubes from the first configuration, in which the cooling tubes vertically oriented, to the second configuration in which each of the cooling tubes is in contact with one of the memory modules that is adjacent thereto.
8 more elements
Dependencies are inferred from the claim text.