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US 10,519,558 B2Granted
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
AssigneeJX Nippon Mining & Metals Corporation
InventorsTomota Nagaura, Masafumi Ishii
Life of this patent
Estimating the term…
Abstract
Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.
Claims9
Copper sulfate comprising a Fe with a concentration of 0.08 ppm by mass or less.
Dependencies are inferred from the claim text.