Leveler compositions for use in copper deposition in manufacture of microelectronics
AssigneeMacDermid Enthone Inc.
InventorsVincent Paneccasio, Jr., Kyle Whitten, Thomas B. Richardson, Ivan Li
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AssigneeMacDermid Enthone Inc.
InventorsVincent Paneccasio, Jr., Kyle Whitten, Thomas B. Richardson, Ivan Li
Estimating the term…
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:
A process for electrodeposition of copper on a dielectric or semiconductor base structure, the method comprising:
A composition for use in electrodeposition of copper for electrodeposition of copper on a dielectric or semiconductor base structure, the composition comprising:
A process for formulating an electrodeposition composition for electrodeposition of copper on a dielectric or semiconductor substrate, the process comprising combining in an aqueous medium a source of copper ions, an acid, a suppressor and a solution of a quaternized poly(epihalohydrin),
Dependencies are inferred from the claim text.