Thermally conductive polyamide compounds containing laser direct structuring additives

A thermally conductive polymer compound, comprising:

• (a) from about 40 to about 50 weight percent of the polymer compound of polyamide 6,
• (b) from about 20 to about 30 weight percent of hexagonal boron nitride,
• (c) from about 20 to about 30 weight percent of talc,
• (d) from about 2 to about 10 weight percent of a laser direct structuring additive,
• (e) from about 7 to about 20 weight percent of glass fiber reinforcing agent,
• (f) from about 0.2 to about 2 weight percent of calcium stearate lubricant,
• (g) from about 0.1 to about 0.4 weight percent of phenolic anti-oxidant, and
• (h) from about 0.1 to about 0.4 tri-aryl phosphite processing stabilizer,
• wherein the compound has an in-plane thermal conductivity of more than 2.5 W/mK as measured using ASTM E1461, a plating index greater than 0.7 as measured according to ASTM B568 (using Pocan 7102 at DOW Circuposit 4500 as a plating reference), and an adhesion strength greater than 0.7 N/mm as measured using IPC-TM-650.