Adhesive composition with high frequency characteristics and application thereof

An adhesive composition with high frequency characteristics, wherein, the adhesive composition has a total weight of the following components in 100 parts by weight, consisting of

• A:
• 30-60 parts by weight of solvent-soluble polyimide, said solvent-soluble polyimide having the structure expressed by the following formula:
• wherein, R1 represents an organic group containing carboxyl;
• X represents a quadrivalent organic group containing at least two of fluorine functional group, aliphatic functional group and alicyclic functional group;
• n is an integer above 0;
• B:
• 5-25 parts by weight of propenyl-modified polyphenylene oxide resin, in which the end group of the propenyl-modified polyphenylene oxide resin contains propenyl organic group, wherein the average molecular weight of said propenyl-modified polyphenylene oxide resin is 1000-5000, and the structure is expressed by the following formula:
• wherein, R2 is an organic group containing a propenyl group;
• R3, R4, R5 and R6 are all selected from alkyl or phenyl with a carbon number below 6;
• n is an integer not larger than 300;
• C:
• 10-20 parts by weight of epoxy resin;
• D:
• 10-15 parts by weight of flexibilizer;
• E:
• 10-15 parts by weight of flame retardant;
• F:
• 5-10 parts by weight of inorganic filler
• G:
• greater than zero and not exceeding 1 part by weight of coupling agent;
• and
• H:
• 0.2-0.5 parts by weight of catalyst.