Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof
AssigneeHenkel IP & Holding GmbH
InventorQiaohong Huang
Life of this patent
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AssigneeHenkel IP & Holding GmbH
InventorQiaohong Huang
Estimating the term…
Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.
A composition comprising:
Dependencies are inferred from the claim text.