MEMS pressure sensor and microphone devices having through-vias and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Wen Cheng, Chia-Hua Chu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Wen Cheng, Chia-Hua Chu
Estimating the term…
A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.
A device comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.