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US 10,519,031 B2Granted
Encapsulations for mems sense elements and wire bonds
AssigneeSensata Technologies, Inc.
InventorsFrank Morsink, Rijk Lorenzo
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Abstract
A MEMS sensor including a housing defining an interior and an inlet in fluid communication with an environment for sensing, a sensing die coupled to the housing for generating a signal based on the environment, an encapsulant is applied to the sensing die to protect the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition of a non-crosslinked substance having an organic backbone, and a silica thickener.
Claims16
A MEMS sensor comprising:
- a housing defining an interior and an inlet in fluid communication with an environment for sensing;
- a sensing die coupled to the housing for generating a signal based on the environment;
- and
- an encapsulant applied to the sensing die for protecting the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition comprising a non-crosslinked dispersion of an organic substance and an inorganic silica thickener;
- wherein the sensor is a pressure sensor.
2 more elements
A method for making a MEMS sensor comprising the steps of:
- providing a housing defining an interior and an inlet in fluid communication with an environment for sensing;
- providing a sensing die coupled to the housing for generating a signal based on the environment;
- applying an encapsulant to the sensing die for protecting the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition comprising a non-crosslinked dispersion of an organic substance and an inorganic silica thickener,
- wherein the sensor is a pressure sensor.
1 more element
Dependencies are inferred from the claim text.