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US 10,519,030 B2Granted
Transducer package with integrated sealing
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Franz Gabler, Thomas Mueller, Horst Theuss, Mathias Vaupel
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Abstract
A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.
Claims14
A package, comprising:
- a carrier;
- a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal;
- a package housing at least partially housing at least one of the carrier and the transducer;
- and
- a sealing for sealing between the package and a package-external body;
- wherein the sealing forms at least part of the package housing and the package housing comprises or consists of an elastic material,
- wherein the sealing is configured for fluidically decoupling an interior with regard to an exterior of an electronic device when the package is mounted in the electronic device,
- wherein the sealing extends beyond an edge of the transducer in at least one of a vertical direction and a lateral direction.
5 more elements
A method of manufacturing a package, the method comprising:
- providing a transducer configured for converting between a package-external property and an electric signal;
- at least partially housing the transducer by a package housing comprising or consisting of an elastic material;
- and
- forming a sealing as at least part of the package housing for sealing between the package and a package-external body, wherein the sealing extends beyond an edge of the transducer in at least one of a vertical direction and a lateral direction and wherein the sealing is configured for fluidically decoupling an interior with regard to an exterior of an electronic device when the package is mounted in the electronic device.
1 more element
Dependencies are inferred from the claim text.