Polysilicon package
AssigneeTokuyama Corporation
InventorsSatoko Yoshimura, Takuya Asano
Life of this patent
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Abstract
A package in which a bag formed from a polyethylene-based resin film having a small thickness, more specifically a thickness of 300 μm or less is filled with crushed polysilicon (Si chunks) and damage to the bag by the Si chunks is effectively prevented. In a polysilicon package in which the bag 1 formed from a polyethylene-based resin having an average thickness of 300 μm or less is filled with the Si chunks 4, the bag 1 has a heat-sealed bonded part 2 at the bottom and is filled with the Si chunks 4 to ensure that the maximum expansion of the bag 1 becomes 5% or less when the bag 1 is held in an upright state with the bottom as a ground contact surface.
Claims7
A polysilicon package in which a bag formed from a linear low-density polyethylene (LLDPE)-based resin film having an average thickness of 300 μm or less is filled with crushed polysilicon that is obtained by mechanically crushing a polysilicon rod, wherein:
- the bag has a heat-sealed bonded part at a bottom and filled with crushed polysilicon to ensure that a maximum expansion of the bag is not less than 0% but is 5% or less while the bag is held in an upright state with the bottom as a ground contact surface, and
- the linear low-density polyethylene-based resin film forming the bag is metallocene-catalyzed linear low-density polyethylene.
A process for producing a polysilicon package, comprising steps of:
- holding a bag formed from a linear low-density polyethylene (LLDPE)-based resin film having an average thickness of 300 μm or less in an upright state with a filling opening thereof facing up and a bottom as a ground contact surface when crushed polysilicon that is obtained by mechanically crushing a polysilicon rod are to be filled;
- and
- filling crushed polysilicon from the filling opening to ensure that a maximum expansion of the bag is not less than 0% but is 5% or less,
- wherein the expansion of the bag to be filled with the crushed polysilicon is suppressed by inserting the bag into a frame to fill the crushed polysilicon, and
- wherein the linear low-density polyethylene-based resin film is metallocene-catalyzed linear low-density polyethylene.
Dependencies are inferred from the claim text.