Ultrasonic bonding device and ultrasonic bonding method

An ultrasonic bonding device comprising:

• a processing member that bonds members to be bonded by applying ultrasonic waves thereto;
• a biasing member oppositely disposed from the processing member across the members to be bonded, and that biases the members to be bonded towards the processing member;
• a first moving unit that separates each of the processing member and the biasing member from each other and that approaches each other with respect to a transport path of the members to be bonded;
• and
• a second moving unit that moves the members to be bonded along the transport path in a state in which the processing member and the biasing member are separated from the transport path, and that positions the bonding portion of the members to be bonded between the processing member and the biasing member, wherein
• the first moving unit comprises a coupling cam rotationally driven by a driving unit, a first connecting portion that couples the coupling cam and the processing member, and a second connecting portion that couples the coupling cam and the biasing member, and that causes the processing member and the biasing member to separate from and approach each other with respect to the transport path by the rotation of the coupling cam,
• the first moving unit comprises at least one of a first pressing member that controls the pressing force of the processing member against the members to be bonded to be constant, and a second pressing member that controls the pressing force of the biasing member against the members to be bonded to be constant.