Laminated substrate
AssigneeIteq Corporation
InventorsTa-Yuan Yu, Kai-Yang Chen, Yen-Hsing Wu
Life of this patent
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Abstract
A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.
Claims10
A laminated substrate, comprising:
- a resin substrate, comprising a plurality of prepregs, wherein each of the prepreg is made of a glass fiber fabric coated with the halogen-free epoxy resin composition;
- and
- a metal foil layer disposed on at least one surface of the resin substrate;
- wherein, the halogen-free epoxy resin composition includes:
- (a) 100 parts by weight of a halogen-free naphthalene based epoxy resin;
- (b) 10 to 25 parts by weight of DOPO modified curing agent;
- (c) 25 to 45 parts by weight of cyanate resin;
- (d) 35 to 60 parts by weight of bismaleimide;
- (e) 45 to 65 parts by weight of non-DOPO flame retardant;
- and
- (f) 0.5 to 15 parts by weight of accelerating agent.
Dependencies are inferred from the claim text.