Polishing pad and polishing method
AssigneeIV Technologies CO., Ltd.
InventorsYu-Piao Wang, I-Ping Chen
Life of this patent
Estimating the term…
Abstract
A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.
Claims43
A polishing pad suitable for a polishing procedure using a slurry containing water, the polishing pad comprising:
- a polishing track region comprising a central region and a peripheral region surrounding the central region;
- and
- a first reactant disposed in the central region of the polishing track region, wherein the first reactant reacts endothermically with the water in the slurry.
A polishing pad suitable for a polishing procedure using a slurry containing water, the polishing pad comprising:
- a polishing track region and a non-polishing track region, wherein the polishing pad satisfies at least one of the following conditions:
- (a) a first reactant is disposed in the polishing track region, wherein the first reactant reacts endothermically with the water in the slum′, and
- (b) a second reactant is disposed in the non-polishing track region, wherein the second reactant reacts exothermically with the water in the slurry.
A polishing pad suitable for a polishing procedure using a slurry containing water, the polishing pad comprising:
- a polishing track region comprising a central region and a peripheral region surrounding the central region, wherein the polishing pad satisfies at least one of the following conditions:
- (c) a first reactant is disposed in the central region of the polishing track region, wherein the first reactant reacts endothermically with the water in the slurry, and
- (d) a second reactant is disposed in the peripheral region of the polishing track region, wherein the second reactant reacts exothermically with the water in the slung.
A polishing pad suitable for a polishing procedure using a slurry containing water, the polishing pad satisfying at least one of the following conditions:
- (e) a first reactant is disposed in the polishing pad, wherein the first reactant reacts endothermically with the water in the slurry, and
- (f) a second reactant is disposed in the polishing pad, wherein the second reactant reacts exothermically with the water in the slurry.
Dependencies are inferred from the claim text.