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US 10,518,382 B2Granted
Substrate processing system
AssigneeKctech Co., Ltd.
InventorsYoung Kyu Kweon, Byoung Chaul Son, Moon Gi Cho, Joon Ho An
Life of this patent
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Abstract
A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.
Claims35
A substrate processing system comprising:
- a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
- a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
- an inverting unit disposed in the pre-cleaning region and gripping the substrate in the pre-cleaning region to invert the substrate;
- and
- a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.
2 more elements
A substrate processing system comprising:
- a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
- a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
- a blocking unit for blocking a pre-cleaning processing space of the pre-cleaning region from other spaces while the pre-cleaning is being performed in the pre-cleaning region;
- and
- a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.
2 more elements
A substrate processing system comprising:
- a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
- a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
- a first buffer module prepared in the polishing part so as to receive the substrate having undergone the polishing process in the polishing part when the pre-cleaning process is being performed on the substrate in the pre-cleaning region, wherein the first buffer module comprises a plurality of cradles to receive a plurality of substrates, which are placed on the plurality of cradles;
- and
- a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.
2 more elements
A substrate processing system comprising:
- a polishing part performing a Chemical Mechanical Polishing process on a substrate;
- a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
- and
- a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region, wherein the cleaning part comprises:
- a plurality of cleaning units stacked in a vertical direction and individually performing cleaning on the substrate;
- and
- a transfer unit transferring the substrate from one of the plurality of cleaning units to another of the plurality of cleaning units,
- wherein the substrate is cleaned along a cleaning path that passes through at least one of the plurality of cleaning units in the cleaning part.
5 more elements
Dependencies are inferred from the claim text.