Methods and articles for lapping stacked row bars having in-wafer ELG circuits

A method of lapping multiple row bars provided in a stack that comprises at least one electrical trace extending through at least two row bars of the stack, the method comprising the steps of:

• electrically connecting at least one row bar bond pad of a first row bar of the stack to at least one carrier bond pad of a carrier, wherein the first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack;
• electrically connecting an outermost row bar of the stack to the first row bar of the stack by the at least one electrical trace, wherein the outermost row bar comprises at least one electronic lapping guide;
• lapping an outer surface of the outermost row bar until a signal provided by the at least one electronic lapping guide of the outermost row bar reaches a predetermined value;
• terminating the lapping of the outer surface of the outermost row bar;
• and
• removing the outermost row bar from the stack to expose a second row bar, wherein the second row bar is electrically connected to the first row bar of the stack with the at least one electrical trace.