Flux and resin composition for flux
AssigneeSenju Metal Industry Co., Ltd.
InventorsHiroyuki Yamasaki, Takashi Hagiwara, Hiroyoshi Kawasaki
Life of this patent
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Abstract
An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
Claims9
A flux comprising:
- at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride;
- and
- 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
A resin composition for a flux, comprising:
- at least one selected from 2.0 to 14.0 mass % of an organochlorine compound and 0.27 to 7.00 mass % of an amine hydrochloride;
- and
- 1.0 to 10.0 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole composition for a flux.
Dependencies are inferred from the claim text.