Solder alloy, solder paste, and electronic circuit board
AssigneeHarima Chemicals, Inc.
InventorsKazuki Ikeda, Kosuke Inoue, Kazuya Ichikawa, Tadashi Takemoto
Life of this patent
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Abstract
A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.
Claims7
A solder alloy consisting of tin, silver, copper, bismuth, antimony, and cobalt, and optionally at least one element selected from the group consisting of nickel and indium, and no or a small amount of inevitable impurities, wherein
- relative to a total amount of the solder alloy,
- the silver content is 3 mass % or more and 3.5 mass % or less,
- the copper content is 0.4 mass % or more and less than 0.6 mass %,
- the bismuth content is 3.5 mass % or more and 4.8 mass % or less,
- the antimony content is 3 mass % or more and 5.5 mass % or less,
- the cobalt content is more than 0.008 mass % and 0.1 mass % or less,
- the content of the at least one optional element selected from the group consisting of nickel and indium, if contained, is 0.2 mass % or less, and
- the balance is the tin content;
- and
- a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.
Dependencies are inferred from the claim text.