Method for fabricating flexible substrate
AssigneeLG Chem, Ltd.
InventorsHye Won Jeong, Yong Goo Son, Kyungjun Kim, Bo Ra Shin, Chang Yoon Lim
Life of this patent
Estimating the term…
Abstract
The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.
Claims12
A method for producing a flexible substrate, comprising feeding a carrier substrate comprising a polyimide resin, forming a flexible substrate layer comprising a polyimide resin on the carrier substrate, separating the flexible substrate layer from the carrier substrate layer by the application of a physical stimulus without causing chemical changes in the carrier substrate and the flexible substrate layer, and winding the flexible substrate layer separated from the carrier substrate layer to collect the flexible substrate layer in the form of a roll wherein the steps are performed by a roll-to-roll process, and wherein the carrier substrate layer has an adhesion strength of at least 1 N/cm to the flexible substrate layer before application of the physical stimulus.
Dependencies are inferred from the claim text.