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US 10,506,712 B1Granted
Printed circuit board
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPei-Haw Tsao, Tsung-Hsing Lu, Li-Huan Chu
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Abstract
Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.
Claims19
A structure comprising:
- a printed circuit board (PCB) comprising insulating layers with respective metal layers being disposed therebetween, wherein:
- each of first layers of the insulating layers includes a first fiberglass content, one of the first layers on another of the first layers without an intervening insulating layer between the one of the first layers and the another of the first layers,
- a second layer of the insulating layers has a second fiberglass content less than the first fiberglass content, the second layer of the insulating layers is on one of the first layers of the insulating layers, and
- another of a first layer of the insulating layers is over the second layer of the insulating layers.
1 more element
A structure comprising:
- a printed circuit board (PCB) comprising:
- a plurality of first outer insulating layers, each of the plurality of first outer insulating layers including a first fiberglass matrix, one of the plurality of first outer insulating layers directly on another of the plurality of first outer insulating layers;
- and
- at least one of a first inner insulating layer free of a fiberglass matrix on one of the plurality of first outer insulating layers,
- wherein up to one-half of the combined number of first outer insulating layers and at least one first inner insulating layer comprise the first outer insulating layers.
2 more elements
Dependencies are inferred from the claim text.