Semiconductor device and method for forming the same

Abstract

A method of forming a semiconductor structure is disclosed, comprising providing a substrate, forming at least a gate trench extending along a first direction in the substrate, forming a gate dielectric layer conformally covering the gate trench, forming a sacrificial layer on the gate dielectric layer and completely filling the gate trench, forming a plurality of openings through the sacrificial layer in the gate trench thereby exposing a portion of the gate dielectric layer, forming a dielectric material in the openings, performing an etching back process to remove a portion of the dielectric material until the dielectric material only remains at a lower portion of each of the openings thereby obtaining a plurality of intervening structures, removing the sacrificial layer, and forming a gate metal filling the gate trench, wherein the intervening structures are disposed between the gate metal and the gate dielectric layer.

Dependencies are inferred from the claim text.