# US 10,504,947 B2 · Solid-state image sensor and camera

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- Number: US 10,504,947 B2
- Document ID: US10504947B2
- Status: Granted
- Kind: B2
- Application number: 15/668,820
- Filed: 2017-08-04
- Published: 2017-11-23
- Granted: 2019-12-10
- Earliest claimed: 2011-10-03
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Masaaki Minowa; Hidekazu Takahashi; Yuichiro Yamashita; Akira Okita
- Web page: https://patentgrep.com/patent/US10504947B2

## CPC

- H10F 39/8027: {Geometry of the photosensitive area}
- H04N 25/00: Circuitry of solid-state image sensors [SSIS]; Control thereof
- H10F 39/151: {Geometry or disposition of pixel elements, address lines or gate electrodes}
- H10F 39/199: {Back-illuminated image sensors}
- H10F 39/8037: {the integrated elements comprising a transistor}
- H10F 39/8063: {Microlenses}
- H10F 39/811: {Interconnections}
- H10F 39/813: {Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges to be accumulated in the photoelectric converter. The sensor also includes a microlenses which are located so that one microlens is arranged for each pixel group. The wiring patterns are located at a side of the first face, and the plurality of microlenses are located at a side of the second face. Light-incidence faces of the regions of the photoelectric converters of each pixel group are arranged along the second face such that the light-incidence faces are apart from each other in a direction along the second face.

## Claims

### Claim 1

A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising:
a plurality of pixel groups each including a plurality of photoelectric converters located in the semiconductor substrate and arranged along the second face of the semiconductor substrate;
a wiring layer located at a side of the first face of the semiconductor substrate; and
a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the plurality of photoelectric converters of a corresponding one of the plurality of pixel groups,
wherein each of the plurality of pixel groups includes a floating diffusion arranged to overlap with one of the plurality of microlenses in a plan view, a first transfer gate configured to transfer charges from a first photoelectric converter of the plurality of photoelectric converters to the floating diffusion, and a second transfer gate configured to transfer charges from a second photoelectric converter of the plurality of photoelectric converters to the floating diffusion, the floating diffusion being arranged between the first transfer gate and the second transfer gate in the plan view.

### Claim 2 (depends on 1)

The sensor according to claim 1, wherein each of the plurality of photoelectric converters of each of the plurality of pixel groups includes a first portion arranged between the first face and the second face, and a second portion arranged between the first portion and the second face, and
wherein, in a plane view, a first closed figure formed by a first outer edge that is an outer edge of the first portion is located within a second closed figure formed by a second outer edge that is an outer edge of the second portion, such that the first outer edge is inwardly spaced apart from the second outer edge.

### Claim 3 (depends on 1)

The sensor according to claim 1, wherein each of the plurality of photoelectric converters of each of the plurality of pixel groups includes a first portion arranged between the first face and the second face, and a second portion arranged between the first portion and the second face, the first portion having a first side face and a second side face opposite to the first side face, the second portion having a third side face and a fourth side face opposite to the third side face, and
wherein, in a plane view, the first side face and the second side face are arranged between the third side face and the fourth side face.

### Claim 4 (depends on 1)

The sensor according to claim 1, wherein the plurality of pixel groups includes first, second, and third pixel groups, which are arranged adjacent to each other, and the plurality of microlenses includes first, second, and third microlenses respectively corresponding to the first, second, and third pixel groups, and
wherein the second microlens borders the first microlens, and the third microlens is spaced apart from the first microlens.

### Claim 5 (depends on 4)

The sensor according to claim 4, wherein the third microlens borders the second microlens.

### Claim 6 (depends on 4)

The sensor according to claim 4, wherein the plurality of photoelectric converters of each of the plurality of pixel groups includes first and second photoelectric converters arranged along a first direction, and
wherein the first microlens and the second microlens are arranged along the first direction.

### Claim 7 (depends on 6)

The sensor according to claim 6, wherein the first microlens and the third microlens are arranged along a second direction intersecting with the first direction.

### Claim 8 (depends on 4)

The sensor according to claim 4, wherein the first pixel group and the second pixel group receive lights passed through different color filters of different color type.

### Claim 9 (depends on 4)

The sensor according to claim 4, wherein the floating diffusion is arranged between the plurality of photoelectric converters of the first pixel group in a plan view.

### Claim 10 (depends on 9)

The sensor according to claim 9, wherein a semiconductor region is arranged between a first photoelectric converter of the plurality of photoelectric converters and a second photoelectric converter of the plurality of photoelectric converters, the semiconductor region being arranged to overlap with one of the plurality of microlenses in a plan view.

### Claim 11 (depends on 10)

The sensor according to claim 10, wherein the floating diffusion is arranged to overlap with the semiconductor region in a plan view.

### Claim 12 (depends on 4)

The sensor according to claim 4, wherein the floating diffusion of the first pixel group is arranged, in a plan view, to overlap with a position of a center between a first border of the microlens of the first pixel group and a second border of the microlens of the first pixel group, the first border and the second border being positioned opposite with each other.

### Claim 13 (depends on 12)

The sensor according to claim 12, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 14 (depends on 1)

The sensor according to claim 1, wherein each of the plurality of pixel groups is configured to receive light passed through a color filter of only one color type.

### Claim 15 (depends on 1)

The sensor according to claim 1, wherein the first photoelectric converter, the first transfer gate, the floating diffusion, the second transfer gate and the second photoelectric converter are arranged along a predetermined direction in a plan view.

### Claim 16 (depends on 15)

The sensor according to claim 15, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 17 (depends on 1)

The sensor according to claim 1, wherein the plurality of photoelectric converters includes first to fourth photoelectric converters, and
wherein the first photoelectric converter and the second photoelectric converter are arranged along a first direction, the first photoelectric converter and the third photoelectric converter are arranged along a second direction, the first photoelectric converter and the fourth photoelectric converter are arranged along a third direction, and
wherein the first direction, the second direction and the third direction are not parallel with each other.

### Claim 18

A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising:
a plurality of pixel groups each including a plurality of photoelectric converters located in the semiconductor substrate;
a wiring layer located at a side of the first face of the semiconductor substrate; and
a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the plurality of photoelectric converters of a corresponding one of the plurality of pixel groups,
wherein each of the plurality of photoelectric converters of each of the plurality of pixel groups includes a semiconductor region of a first conductivity type that is configured to accumulate charges generated by photoelectric conversion,
wherein, in each of the plurality of pixel groups, an impurity concentration of a second conductivity type in a region of the semiconductor substrate that is located between the first face and an end portion of a corresponding microlens of the plurality of microlenses is greater than an impurity concentration of the second conductivity type in a region of the semiconductor substrate that is located between the first face and a center of the corresponding microlens, and
wherein each of the plurality of pixel groups includes a floating diffusion arranged to overlap with one of the plurality of microlenses in a plan view, a first transfer gate configured to transfer charges from a first photoelectric converter of the plurality of photoelectric converters to the floating diffusion, and a second transfer gate configured to transfer charges from a second photoelectric converter of the plurality of photoelectric converters to the floating diffusion, the floating diffusion being arranged between the first transfer gate and the second transfer gate in the plan view.

### Claim 19 (depends on 18)

The sensor according to claim 18, wherein the plurality of pixel groups includes first, second, and third pixel groups, which are arranged adjacent to each other, and the plurality of microlenses includes first, second, and third microlenses respectively corresponding to the first, second, and third pixel groups,
wherein the second microlens borders the first microlens, and the third microlens is spaced apart from the first microlens.

### Claim 20 (depends on 19)

The sensor according to claim 19, wherein the floating diffusion of the first pixel group is arranged, in a plan view, to overlap with a positon of a center between a first border of the microlens of the first pixel group and a second border of the microlens of the first pixel group, the first border and the second border being positioned opposite with each other.

### Claim 21 (depends on 20)

The sensor according to claim 20, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 22 (depends on 18)

The sensor according to claim 18, wherein the floating diffusion is arranged between the plurality of photoelectric converters of the first pixel group in a plan view.

### Claim 23 (depends on 22)

The sensor according to claim 22, wherein a semiconductor region of the second conductivity type is arranged between a first photoelectric converter of the plurality of photoelectric converters and a second photoelectric converter of the plurality of photoelectric converters, the semiconductor region of the second conductivity type being arranged to overlap with one of the plurality of microlenses in a plan view.

### Claim 24 (depends on 23)

The sensor according to claim 23, wherein the floating diffusion is arranged to overlap with the semiconductor region of the second conductivity type in a plan view.

### Claim 25 (depends on 18)

The sensor according to claim 18, wherein the first photoelectric converter, the first transfer gate, the floating diffusion, the second transfer gate and the second photoelectric converter are arranged along a predetermined direction in a plan view.

### Claim 26 (depends on 25)

The sensor according to claim 25, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 27 (depends on 18)

The sensor according to claim 18, wherein the plurality of photoelectric converters includes first to fourth photoelectric converters, and
wherein the first photoelectric converter and the second photoelectric converter are arranged along a first direction, the first photoelectric converter and the third photoelectric converter are arranged along a second direction, the first photoelectric converter and the fourth photoelectric converter are arranged along a third direction, and
wherein the first direction, the second direction and the third direction are not parallel with each other.

### Claim 28

A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising:
a plurality of pixel groups each including a plurality of photoelectric converters located in the semiconductor substrate;
a wiring layer located at a side of the first face of the semiconductor substrate; and
a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the plurality of photoelectric converters of a corresponding one of the plurality of pixel groups,
wherein the plurality of pixel groups includes first, second, and third pixel groups, which are arranged adjacent to each other, and the plurality of microlenses includes first, second, and third microlenses respectively corresponding to the first, second, and third pixel groups,
wherein the second microlens borders the first microlens, and the third microlens is spaced apart from the first microlens,
wherein each of the plurality of photoelectric converters of each of the plurality of pixel groups includes a semiconductor region of a first conductivity type that is configured to accumulate charges generated by photoelectric conversion,
wherein an impurity concentration of a second conductivity type in a region of the semiconductor substrate that is located between the first face and a border between the first microlens and the second microlens is greater than an impurity concentration of the second conductivity type in a region of the semiconductor substrate that is located between the first face and a center of the first microlens, and
wherein each of the plurality of pixel groups includes a floating diffusion arranged to overlap with one of the plurality of microlenses in a plan view, a first transfer gate configured to transfer charges from a first photoelectric converter of the plurality of photoelectric converters to the floating diffusion, and a second transfer gate configured to transfer charges from a second photoelectric converter of the plurality of photoelectric converters to the floating diffusion, the floating diffusion being arranged between the first transfer gate and the second transfer gate in the plan view.

### Claim 29

A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising:
a plurality of pixel groups each including a plurality of photoelectric converters located in the semiconductor substrate and arranged along the second face of the semiconductor substrate, the plurality of photoelectric converters of each of the plurality of pixel groups being arranged so as not to overlap with each other in a plan view;
a wiring layer located at a side of the first face of the semiconductor substrate; and
a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the plurality of photoelectric converters of a corresponding one of the plurality of pixel groups,
wherein each of the plurality of pixel groups includes a floating diffusion arranged to overlap with one of the plurality of microlenses in the plan view, a first transfer gate configured to transfer charges from a first photoelectric converter of the plurality of photoelectric converters to the floating diffusion, and a second transfer gate configured to transfer charges from a second photoelectric converter of the plurality of photoelectric converters to the floating diffusion, the floating diffusion being arranged between the first transfer gate and the second transfer gate in the plan view.

### Claim 30 (depends on 29)

The sensor according to claim 29, wherein the plurality of pixel groups includes first, second, and third pixel groups, which are arranged adjacent to each other, and the plurality of microlenses includes first, second, and third microlenses respectively corresponding to the first, second, and third pixel groups, and
wherein the second microlens borders the first microlens, and the third microlens is spaced apart from the first microlens.

### Claim 31 (depends on 30)

The sensor according to claim 30, wherein the floating diffusion is arranged between the plurality of photoelectric converters of the first pixel group in a plan view.

### Claim 32 (depends on 31)

The sensor according to claim 31, wherein a semiconductor region is arranged between a first photoelectric converter of the plurality of photoelectric converters and a second photoelectric converter of the plurality of photoelectric converters, the semiconductor region being arranged to overlap with one of the plurality of microlenses in a plan view.

### Claim 33 (depends on 32)

The sensor according to claim 32, wherein the floating diffusion is arranged to overlap with the semiconductor region in a plan view.

### Claim 34 (depends on 30)

The sensor according to claim 30, wherein the floating diffusion of the first pixel group is arranged, in a plan view, to overlap with a positon of a center between a first border of the microlens of the first pixel group and a second border of the microlens of the first pixel group, the first border and the second border being positioned opposite with each other.

### Claim 35 (depends on 34)

The sensor according to claim 34, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 36 (depends on 29)

The sensor according to claim 29, wherein the first photoelectric converter, the first transfer gate, the floating diffusion, the second transfer gate and the second photoelectric converter are arranged along a predetermined direction in a plan view.

### Claim 37 (depends on 36)

The sensor according to claim 36, wherein the first transfer gate and the second transfer gate of one of the plurality of pixel groups are arranged to overlap one of the plurality of microlenses in a plan view.

### Claim 38 (depends on 29)

The sensor according to claim 29, wherein
each of the plurality of photoelectric converters includes a first semiconductor region having a first conductivity type configured to accumulate charges generated by photoelectric conversion, and a second semiconductor region arranged between the first semiconductor region and the second face, and having a second conductivity type, and
wherein a plurality of the first semiconductor regions of each of the plurality of pixel groups are arranged so as not to overlap with each other in a plan view.

### Claim 39

A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising:
a plurality of pixel groups each including a plurality of photoelectric converters located in the semiconductor substrate and arranged along the second face of the semiconductor substrate, each of the plurality of photoelectric converters of each of the plurality of the pixel groups including a first semiconductor region having a first conductivity type, and a second semiconductor region arranged between the first semiconductor region and the second face and having the first conductivity type, impurity concentration of the first conductivity type of the second semiconductor region being lower than that of the first semiconductor region, the second semiconductor regions of the plurality of photoelectric converters of each of the plurality of the pixel groups being arranged in the same depth from the first face;
a wiring layer located at a side of the first face of the semiconductor substrate; and
a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the plurality of photoelectric converters of a corresponding one of the plurality of pixel groups,
wherein the plurality of pixel groups includes first, second, and third pixel groups, which are arranged adjacent to each other, and the plurality of microlenses includes first, second, and third microlenses respectively corresponding to the first, second, and third pixel groups, and
wherein the second microlens borders the first microlens, and the third microlens is spaced apart from the first microlens.

### Claim 40 (depends on 29)

The sensor according to claim 29, wherein the plurality of photoelectric converters includes first to fourth photoelectric converters, and
wherein the first photoelectric converter and the second photoelectric converter are arranged along a first direction, the first photoelectric converter and the third photoelectric converter are arranged along a second direction, the first photoelectric converter and the fourth photoelectric converter are arranged along a third direction, and
wherein the first direction, the second direction and the third direction are not parallel with each other.