# US 10,504,878 B2 · LED module assemblies for displays > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,878 B2 - Document ID: US10504878B2 - Status: Granted - Kind: B2 - Application number: 16/152,380 - Filed: 2018-10-04 - Published: 2019-04-18 - Granted: 2019-12-10 - Earliest claimed: 2017-10-12 - Assignees: Lumens Co., Ltd. - Applicants: Lumens Co., Ltd. - Inventors: Chunki Min; Keunoh Kim; Huikyeong Noh; Kyungmin Cho - Web page: https://patentgrep.com/patent/US10504878B2 ## CPC - H10W 90/00: Package configurations - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/853: characterised by their shape - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other. ## Claims ### Claim 1 An LED module assembly for a display comprising a first LED module and a second LED module wherein the first LED module comprises a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate; the second LED module comprises a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate; the first unit substrate and the second unit substrate are laterally connected to each other; each of the first light absorbing layer and the second light absorbing layer comprises a plurality of valleys formed between the plurality of pixels; the first light absorbing layer and the second light absorbing layer comprise a first inclined portion and a second inclined portion, respectively; and at least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion, wherein the surface of each of the plurality of LED chips lies at the same level as the upper end of the corresponding valley and is exposed to the outside. ### Claim 2 (depends on 1) The LED module assembly according to claim 1, wherein each of the light absorbing layers comprises valleys formed between the adjacent LED chips in the plurality of pixels. ### Claim 3 (depends on 2) The LED module assembly according to claim 2, wherein the widths of the valleys between the pixels are larger than those of the valleys between the chips. ### Claim 4 (depends on 1) The LED module assembly according to claim 1, wherein each of the light absorbing layers is formed by applying a liquid or gel-like material comprising a black color material to the surface of the corresponding substrate. ### Claim 5 (depends on 1) The LED module assembly according to claim 1, wherein each of the valleys is formed obliquely from the upper end edge of the side surface of the corresponding LED chip toward the lower end of the valley closest to the surface of the corresponding substrate. ### Claim 6 (depends on 5) The LED module assembly according to claim 5, wherein the lower end of each of the valleys between the chips is located in the central portion between the two adjacent LED chips. ### Claim 7 (depends on 1) The LED module assembly according to claim 1, wherein the LED module assembly comprises a light absorbing part formed at the interface between the first unit substrate and the second unit substrate. ### Claim 8 (depends on 1) The LED module assembly according to claim 1, wherein the light absorbing part is formed by spreading a material having a light absorbing color on the side surface of the first unit substrate and the side surface of the second unit substrate in contact with each other. ### Claim 9 (depends on 1) The LED module assembly according to claim 1, wherein at least one of the plurality of valleys is formed in contact with a light absorbing pattern film previously formed on the first unit substrate or the second unit substrate. ### Claim 10 (depends on 2) The LED module assembly according to claim 2, wherein the valleys between the chips are formed in contact with a light absorbing pattern film previously formed on the first unit substrate or the second unit substrate. ### Claim 11 (depends on 1) The LED module assembly according to claim 1, wherein the plurality of LED chips are flip-chip bonded onto the first unit substrate or the second unit substrate. ### Claim 12 (depends on 1) The LED module assembly according to claim 1, wherein the side surfaces of the first unit substrate and the second unit substrate are vertically cut surfaces. ### Claim 13 (depends on 1) The LED module assembly according to claim 1, wherein the width of the valley formed by the first inclined portion and the second inclined portion at the boundary between the first LED module and the second LED module is the same as the width of the valley formed between the two adjacent pixels on the first substrate or the second substrate. ### Claim 14 An LED module assembly comprising a first LED module and a second LED module wherein the first LED module comprises a first unit substrate, a plurality of LED chips mounted on the first unit substrate, and a first light absorbing layer formed on the first unit substrate; the second LED module comprises a second unit substrate, a plurality of LED chips mounted on the second unit substrate, and a second light absorbing layer formed on the second unit substrate; the first unit substrate and the second unit substrate are laterally connected to each other; each of the first light absorbing layer and the second light absorbing layer comprises a plurality of valleys formed between the plurality of chips; the first light absorbing layer comprises a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate; the second light absorbing layer comprises a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate; and at least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other.