# US 10,504,872 B2 · Method of batch transferring micro semiconductor structures

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- Number: US 10,504,872 B2
- Document ID: US10504872B2
- Status: Granted
- Kind: B2
- Application number: 15/947,178
- Filed: 2018-04-06
- Published: 2018-10-11
- Granted: 2019-12-10
- Earliest claimed: 2017-04-06
- Assignees: Ultra Display Technology Corp.
- Applicants: Ultra Display Technology Corp.
- Inventors: Hsien-Te Chen
- Web page: https://patentgrep.com/patent/US10504872B2

## CPC

- H10W 72/0198: {batch processes}
- H10H 20/01: Manufacture or treatment
- H10H 29/03: using mass transfer of LEDs, e.g. by using liquid suspensions
- H10H 29/0364: {of interconnections}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/30: Die-attach connectors
- H10W 90/00: Package configurations
- H10P 72/7428: {used to support diced chips prior to mounting}
- H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method of batch transferring micro semiconductor structures is provided for effectively and efficiently picking up a batch of or a large amount of micro structures and transferring them to a target substrate, so it can be widely applied in transferring a lot of various micro semiconductor structures. The method includes steps of: attaching an adhesive material to a plurality of array-type micro semiconductor structures; and providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate. The array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.

## Claims

### Claim 1

A method of batch transferring micro semiconductor structures, comprising:
attaching an adhesive material to a semiconductor device, wherein the semiconductor device comprises a native substrate and array-type micro semiconductor structures grown on the native substrate, and the array-type micro semiconductor structures define a plurality of micro semiconductor structures arranged in an array;
removing the native substrate from the semiconductor device and remaining the array-type micro semiconductor structures on the adhesive material; and
providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate, wherein the array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed;
wherein defining a pre-adhering force between the adhesive material and the array-type micro semiconductor structures; defining a picking adhering force between the roll-to-attach mechanism and the array-type micro semiconductor structures; defining a receiving adhering force between the array-type micro semiconductor structures and the target substrate;
wherein the receiving adhering force is greater than the picking adhering force.

### Claim 2 (depends on 1)

The method according to claim 1, wherein:
the roll-to-attach mechanism comprises an attaching roller for performing a rolling motion, and the attaching roller is disposed between the array-type micro semiconductor structures and the target substrate for alternately processing the linear contacts therebetween.

### Claim 3 (depends on 2)

The method according to claim 2, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
keeping at least one of the array-type micro semiconductor structures and the target substrate in a planar surface.

### Claim 4 (depends on 3)

The method according to claim 3, wherein:
the roll-to-attach mechanism comprises a target roller for performing a rolling motion, and the target substrate is adjacent to a roller surface of the target roller.

### Claim 5 (depends on 2)

The method according to claim 2, wherein:
the roll-to-attach mechanism comprises a start roller for performing a rolling motion, and the array-type micro semiconductor structures are adjacent to a roller surface of the start roller.

### Claim 6 (depends on 5)

The method according to claim 5, wherein:
the roll-to-attach mechanism comprises a target roller for performing a rolling motion, and the target substrate is adjacent to a roller surface of the target roller.

### Claim 7 (depends on 2)

The method according to claim 2, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller continuously and alternately processes linear contacts with the array-type micro semiconductor structures, and the attaching roller picks up the micro semiconductor structures in batch from the adhesive material as the linear contacts are processed; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the micro semiconductor structures picked up in batch are transferred from the attaching roller to the target substrate as the linear contacts are processed.

### Claim 8 (depends on 2)

The method according to claim 2, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller continuously and alternately processes linear contacts with the array-type micro semiconductor structures, and the attaching roller picks up at least a row of the micro semiconductor structures from the adhesive material as the linear contacts are processed; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the row of the picked micro semiconductor structures are transferred from the attaching roller to the target substrate as the linear contacts are processed.

### Claim 9 (depends on 2)

The method according to claim 2, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller continuously and alternately processes linear contacts with the array-type micro semiconductor structures, and the attaching roller picks up at least a part of at least a row of the micro semiconductor structures from the adhesive material as the linear contacts are processed; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the at least part of the at least row of the picked micro semiconductor structures are transferred from the attaching roller to the target substrate as the linear contacts are processed.

### Claim 10 (depends on 2)

The method according to claim 2, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller processes linear contacts with the array-type micro semiconductor structures, in which the linear contacts accumulates to a surface contact, and the adhesive material is carried by the attaching roller picking up the micro semiconductor structures as long as the linear contacts are processed;
tearing out the adhesive material from the micro semiconductor structures attached on the attaching roller; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the micro semiconductor structures picked up in batch are transferred from the attaching roller to the target substrate as long as the linear contacts are processed.

### Claim 11 (depends on 1)

The method according to claim 1, wherein:
in the step of attaching the adhesive material to the semiconductor device, the adhesive material comprises at least one glue layer, and the glue layer is a thermal tape;
before or when the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch, the method further comprises:
heating the thermal tape so as to decrease the initial adhering force between the adhesive material and the array-type micro semiconductor structures to the pre-adhering force;
wherein the picking adhering force is greater than the pre-adhering force.

### Claim 12 (depends on 1)

The method according to claim 1, wherein:
the roll-to-attach mechanism comprises a start roller for performing a rolling motion, a target roller for performing a rolling motion, and an attaching plane disposed between the start roller and the target roller, the array-type micro semiconductor structures are adjacent to a roller surface of the start roller, and the target substrate is adjacent to a roller surface of the target roller.

### Claim 13 (depends on 1)

The method according to claim 1, wherein:
before the step of attaching the adhesive material to the semiconductor device, the method further comprises:
disposing two glue layers on a top surface and a bottom surface of a base layer, respectively; and
attaching a transferring substrate on one of the glue layers;
wherein the two glue layers, the base layer and the transferring substrate form the adhesive material.

### Claim 14 (depends on 1)

The method according to claim 1, wherein:
before the step of attaching the adhesive material to the semiconductor device, the method further comprises:
disposing a glue layer on at least one surface of a base layer to form the adhesive material.

### Claim 15 (depends on 14)

The method according to claim 14, wherein:
the step of attaching the adhesive material to the semiconductor device further comprises:
providing a supporting frame disposed around the array-type micro semiconductor structures; and
attaching the adhesive material to both of the array-type micro semiconductor structures and the supporting frame; and
before the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch, the method further comprises:
removing the supporting frame.

### Claim 16 (depends on 15)

The method according to claim 15, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller processes linear contacts with the array-type micro semiconductor structures, in which the linear contacts accumulates to form a surface contact, and the adhesive material is carried by the attaching roller picking up the micro semiconductor structures as long as the linear contacts are processed;
providing a tearing force for tearing out the adhesive material from the micro semiconductor structures attached on the attaching roller; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the micro semiconductor structures picked up in batch are transferred from the attaching roller to the target substrate as long as the linear contacts are processed;
wherein the picking adhering force is greater than the tearing force.

### Claim 17 (depends on 1)

The method according to claim 1, wherein:
the step of removing the native substrate further comprises:
removing the native substrate by laser lift-off or etching;
wherein when removing the native substrate by laser lift-off or etching, the array-type micro semiconductor structures are kept attaching to the adhesive material by an initial adhering force.

### Claim 18 (depends on 1)

The method according to claim 1, wherein:
in the step of attaching the adhesive material to the semiconductor device, the adhesive material comprises at least one glue layer, and the glue layer is a UV tape;
before or when the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch, the method further comprises:
providing a UV light to cure the UV tape so as to decrease the initial adhering force between the UV tape and the array-type micro semiconductor structures to the pre-adhering force;
wherein the picking adhering force is greater than the pre-adhering force.

### Claim 19 (depends on 1)

The method according to claim 1, wherein:
the step of attaching the adhesive material to the semiconductor device further comprises:
providing a supporting frame disposed around the array-type micro semiconductor structures; and
attaching the adhesive material to both of the array-type micro semiconductor structures and the supporting frame; and
before the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch, the method further comprises:
removing the supporting frame.

### Claim 20 (depends on 19)

The method according to claim 19, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller processes from linear contacts with the array-type micro semiconductor structures, in which the linear contacts accumulates to fotin a surface contact, and the adhesive material is carried by the attaching roller picking up the micro semiconductor structures as long as the linear contacts are processed;
tearing out the adhesive material from the micro semiconductor structures attached on the attaching roller; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the micro semiconductor structures picked up in batch are transferred from the attaching roller to the target substrate as long as the linear contacts are processed.

### Claim 21 (depends on 1)

The method according to claim 1, wherein:
the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
providing a set of attaching rollers for rolling and alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate, wherein the set of attaching rollers picks up the micro semiconductor structures in batch from the adhesive material and transfers the picked micro semiconductor structures in batch to the target substrate as the alternate linear contacts are processed; wherein the set of attaching rollers comprises a plurality of attaching rollers for performing a rolling motion, any adjacent two of the attaching rollers generate a linear contact, the first attaching roller picks up the micro semiconductor structures in batch from the adhesive material, and the last attaching roller transfers the micro semiconductor structures in batch to the target substrate.

### Claim 22 (depends on 1)

The method according to claim 1, wherein:
before the step of attaching the adhesive material to the semiconductor device, the method further comprises:
growing the array-type micro semiconductor structures on the native substrate, wherein the array-type micro semiconductor structures are a plurality of individual micro LED chips.

### Claim 23 (depends on 1)

The method according to claim 1, wherein:
before the step of attaching the adhesive material to the semiconductor device, the method further comprises:
growing the array-type micro semiconductor structures on the native substrate, wherein the array-type micro semiconductor structures are a plurality of defined micro semiconductor structures having at least an epitaxy layer.

### Claim 24 (depends on 1)

The method according to claim 1, wherein:
when, before, after or upon the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch:
the array-type micro semiconductor structures on the target substrate are horizontal-electrode micro LED dies.

### Claim 25 (depends on 1)

The method according to claim 1, wherein:
when, before, after or upon the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch:
the array-type micro semiconductor structures on the target substrate are vertical-electrode micro LED dies.

### Claim 26

A method of batch transferring micro semiconductor structures, comprising:
attaching an adhesive material to a semiconductor device, wherein the semiconductor device comprises a native substrate and array-type micro semiconductor structures grown on the native substrate, and the array-type micro semiconductor structures define a plurality of micro semiconductor structures arranged in an array;
removing the native substrate from the semiconductor device and remaining the array-type micro semiconductor structures on the adhesive material; and
providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate, wherein the array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed;
wherein the roll-to-attach mechanism comprises an attaching roller for performing a rolling motion, and the attaching roller is disposed between the array-type micro semiconductor structures and the target substrate for alternately processing the linear contacts therebetween;
wherein the step of providing the roll-to-attach mechanism for picking up in batch and transferring in batch further comprises:
approaching an attaching roller toward the array-type micro semiconductor structures, wherein the attaching roller processes linear contacts with the array-type micro semiconductor structures, in which the linear contacts accumulates to a surface contact, and the adhesive material is carried by the attaching roller picking up the micro semiconductor structures as long as the linear contacts are processed;
tearing out the adhesive material from the micro semiconductor structures attached on the attaching roller; and
keeping the attaching roller rolled and approaching the attaching roller to the target substrate to continuously process linear contacts with the target substrate, wherein the micro semiconductor structures picked up in batch are transferred from the attaching roller to the target substrate as long as the linear contacts are processed.