# US 10,504,870 B2 · Mechanisms for forming bonding structures

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- Number: US 10,504,870 B2
- Document ID: US10504870B2
- Status: Granted
- Kind: B2
- Application number: 15/707,954
- Filed: 2017-09-18
- Published: 2018-01-04
- Granted: 2019-12-10
- Earliest claimed: 2013-07-17
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Bor-Ping Jang; Hsiao-Chung Liang; Chung-Shi Liu
- Web page: https://patentgrep.com/patent/US10504870B2

## CPC

- H10W 72/072: {of bump connectors}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 72/354: {comprising polymers}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.

## Claims

### Claim 1

A method for forming a package structure, the method comprising:
providing a first substrate having a plurality of contact pads formed thereon;
applying a first solder on the plurality of contact pads;
providing a support substrate having a plurality of cavities;
disposing a plurality of first conductive pillars in respective ones of the plurality of cavities;
disposing a plurality of second conductive pillars in respective ones of the plurality of cavities, wherein a shape of the plurality of first conductive pillars is different than a shape of the plurality of second conductive pillars;
attaching the plurality of first conductive pillars and the plurality of second conductive pillars to the plurality of contact pads by the first solder using a first reflow process, the first solder extending between the plurality of contact pads and corresponding ones of the plurality of first conductive pillars and the plurality of second conductive pillars;
after attaching the plurality of first conductive pillars and the plurality of second conductive pillars, forming a protective layer along sidewalls of the plurality of first conductive pillars and the plurality of second conductive pillars; and
after attaching the plurality of first conductive pillars, bonding a second substrate to the plurality of first conductive pillars and the plurality of second conductive pillars with a second solder, wherein the second solder extends along sidewalls of the plurality of first conductive pillars and the plurality of second conductive pillars, wherein the second solder directly contacts the protective layer adjacent a first pillar of the plurality of first conductive pillars, wherein after bonding the second substrate the first solder completely separates the plurality of first conductive pillars from the plurality of contact pads and the second solder completely separates the plurality of first conductive pillars from contact pads of the second substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein disposing the plurality of first conductive pillars comprises:
disposing the plurality of first conductive pillars over a surface of the support substrate; and
vibrating the support substrate such that the plurality of first conductive pillars fall into the plurality of cavities.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first solder extends through an insulating layer.

### Claim 4 (depends on 3)

The method of claim 3, wherein the plurality of first conductive pillars has a width less than a width of the first solder extending through the insulating layer.

### Claim 5 (depends on 1)

The method of claim 1, wherein the plurality of first conductive pillars has a non-uniform width.

### Claim 6 (depends on 1)

The method of claim 1, wherein after bonding the second substrate, the first solder does not contact the second solder.

### Claim 7 (depends on 1)

The method of claim 1, wherein the first solder has a higher reflow temperature than the second solder.

### Claim 8 (depends on 1)

The method of claim 1, wherein the second solder does not directly contact the protective layer adjacent a second pillar of the plurality of second conductive pillars.

### Claim 9 (depends on 1)

The method of claim 1, wherein at least one of the cross-sectional shape of the plurality of first conductive pillars and the cross-sectional shape of the plurality of second conductive pillars is “T” shaped.

### Claim 10 (depends on 9)

The method of claim 9, wherein at least one of the cross-sectional shape of the plurality of first conductive pillars and the cross-sectional shape of the plurality of second conductive pillars is rectangular.

### Claim 11

A method for forming a package structure, the method comprising:
applying a first conductive material to a first contact pad and applying a second conductive material to a second contact pad of a first substrate;
after applying the first conductive material to the first contact pad and the second conductive material to the second contact pad, attaching a first conductive pillar to the first conductive material on the first contact pad and attaching a second conductive pillar to the second conductive material on the second contact pad;
after attaching the first conductive pillar and the second conductive pillar, forming a protective layer over the first substrate, the protective layer completely covering the first conductive material and the second conductive material; and
attaching a second substrate to the first conductive pillar and the second conductive pillar, the second substrate having a third contact pad and a third conductive material on the third contact pad and having a fourth contact pad and a fourth conductive material on the fourth contact pad, wherein after attaching the second substrate the first conductive material completely separates the first conductive pillar from the first contact pad, the second conductive material completely separates the second conductive pillar from the second contact pad, the third conductive material completely separates the first conductive pillar from the third contact pad, and the fourth conductive material completely separates the second conductive pillar from the fourth contact pad, wherein after attaching the second substrate, at least a portion of sidewalls of the second conductive material are free of the protective layer, the third conductive material extends along sidewalls of the first conductive pillar, and the fourth conductive material extends along sidewalls of the second conductive pillar, the third conductive material directly contacts the protective layer, and the fourth conductive material does not directly contact the protective layer.

### Claim 12 (depends on 11)

The method of claim 11, wherein the first contact pad is partially covered with a first insulating layer, the first conductive material extending through the first insulating layer to the first contact pad.

### Claim 13 (depends on 11)

The method of claim 11, wherein the protective layer contacts sidewalls of the first conductive pillar.

### Claim 14 (depends on 11)

The method of claim 11, wherein the first conductive material has a higher reflow temperature than the third conductive material.

### Claim 15 (depends on 11)

The method of claim 11, wherein the second conductive pillar has a different shape than the first conductive pillar.

### Claim 16

A method for forming a package structure, comprising:
applying a first conductive material to a first contact pad of a first substrate;
after applying the first conductive material to the first contact pad, reflowing the first conductive material and attaching a first end of a first conductive pillar to the first conductive material;
after reflowing the first conductive material, forming a protective layer on the first substrate, the first conductive pillar protruding through the protective layer; and
after forming the protective layer, reflowing a second conductive material attaching a second end of the first conductive pillar to a second contact pad of a second substrate, thereby bonding the first substrate to the second substrate, wherein after reflowing the second conductive material the first conductive pillar is spaced apart from the first contact pad and the second contact pad, wherein the second conductive material contacts sidewalls of the first conductive pillar, wherein the first conductive material has a higher reflow temperature than the second conductive material, wherein the second conductive material directly contacts the protective layer; and
attaching the first substrate to the second substrate using a second conductive pillar, wherein attaching the first substrate to the second substrate using the second conductive pillar comprises:
attaching the second conductive pillar to a third contact pad on the first substrate with a third conductive material; and
attaching the second conductive pillar to a fourth contact pad on the second substrate with a fourth conductive material, wherein the fourth conductive material extends along sidewalls of the second conductive pillar, the fourth conductive material being spaced apart from the protective layer.

### Claim 17 (depends on 16)

The method of claim 16, wherein the protective layer completely covers the first conductive material.

### Claim 18 (depends on 16)

The method of claim 16, wherein the protective layer is formed on an insulating layer, wherein the first conductive material contacts the insulating layer.

### Claim 19 (depends on 16)

The method of claim 16, wherein the first conductive pillar has a different shape than the second conductive pillar.