# US 10,504,866 B2 · Semiconductor device connected by anisotropic conductive film

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- Number: US 10,504,866 B2
- Document ID: US10504866B2
- Status: Granted
- Kind: B2
- Application number: 14/030,127
- Filed: 2013-09-18
- Published: 2014-03-27
- Granted: 2019-12-10
- Earliest claimed: 2012-09-21
- Assignees: Kudko Chemical Co., Ltd.
- Applicants: Young Woo Park; Joon Mo Seo; Hyun Min Choi; Ji Yeon Kim; Kyoung Soo Park; Arum Yu; Jong Hyuk Eun
- Inventors: Young Woo Park; Joon Mo Seo; Hyun Min Choi; Ji Yeon Kim; Kyoung Soo Park; Arum Yu; Jong Hyuk Eun
- Web page: https://patentgrep.com/patent/US10504866B2

## CPC

- H10W 72/30: Die-attach connectors
- H10W 72/073: {of die-attach connectors}
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- H10W 72/013: {of die-attach connectors}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.

## Claims

### Claim 1

A liquid crystal display device, comprising:
a first connecting member having a first electrode;
a second connecting member having a second electrode; and
an anisotropic conductive film filling an entire space between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other, and the anisotropic conductive film including:
a polymer binder resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyvinyl butyral resin, and in combination thereof;
an epoxy resin;
conductive particles;
a curing agent; and
silica nanoparticles,
wherein the epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin,
the naphthalene ring-containing epoxy resin is present in an amount of 300 parts by weight to 500 parts by weight, based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin, and
the anisotropic conductive film has a melting viscosity from 0.2 Pa·s to 0.5 Pa·s at 150° C.,
wherein the anisotropic conductive film includes:
5 wt% to 35 wt% of the polymer binder resin;
5 wt% to 25 wt% of the epoxy resin;
5 wt% to 30 wt% of the conductive particles;
30 wt% to 50 wt% of the curing agent, and
0.1 wt% to 20 wt% of the silica nanoparticles, based on a total amount of the anisotropic conductive film in terms of solid content, and
wherein, after curing and after being subjected to conditions of 85° C. and 85% RH for 500hours, the anisotropic conductive film has a bubble area between the first and second electrodes of 20% or less in a space area therebetween.

### Claim 2 (depends on 1)

The liquid crystal display device as claimed in claim 1, wherein the anisotropic conductive film has a moisture absorption rate of 0.8% or less.

### Claim 3 (depends on 1)

The liquid crystal display device as claimed in claim 1, wherein the anisotropic conductive film has an adhesive strength from 30 N/25 mm to 100 N/25 mm.

### Claim 4 (depends on 1)

The liquid crystal display device as claimed in claim 1, wherein the dicyclopentadiene ring-containing epoxy resin has a melting viscosity from 0.1 Pa·s to 1 Pa·s at 150° C.

### Claim 5 (depends on 1)

The liquid crystal display device as claimed claim 1, wherein the anisotropic conductive film, after curing and after being subjected to conditions of 85° C. and 85% RH for 500 hours, has a connection resistance of 10Ω or less.

### Claim 6 (depends on 5)

The liquid crystal display device as claimed in claim 5, wherein the curing is performed at 190° C. to 210° C. for 5 seconds to 10 seconds at a load of 50 MPa to 80 MPa.