# US 10,504,841 B2 · Semiconductor package and method of forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,841 B2 - Document ID: US10504841B2 - Status: Granted - Kind: B2 - Application number: 15/956,055 - Filed: 2018-04-18 - Published: 2019-07-25 - Granted: 2019-12-10 - Earliest claimed: 2018-01-21 - Applicants: Shun-Ping Huang - Inventors: Shun-Ping Huang - Web page: https://patentgrep.com/patent/US10504841B2 ## CPC - H10W 20/4403: {based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence)} - H10P 72/0438: {Apparatus for making assemblies not otherwise provided for, e.g. package constructions} - H10P 72/74: {using temporarily an auxiliary support} - H10W 40/251: {Organics} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/0198: {batch processes} - H10W 72/30: Die-attach connectors - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 76/17: characterised by their materials - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10P 72/7422: {used to protect an active side of a device or wafer} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10P 72/7436: {used to support a device or a wafer when forming electrical connections thereto} - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 74/473: {containing a filler} - H10W 90/10: Configurations of laterally-adjacent chips - H10W 90/722: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An embodiment method includes providing a fan-out package structure having cavities to confine semiconductor dies by applying adhesive material which has similar coefficient of thermal expansion (CTE) with semiconductor dies in the gap between the edges of dies and the edges of cavities. The method further includes forming a molding compound over a fan-out package structure with semiconductor dies, building fan-out redistribution layers over a fan-out package structure with semiconductor dies and electrically connected to the semiconductor dies. ## Claims ### Claim 1 A method of forming a semiconductor package, comprising: attaching a fan-out package structure to a carrier, the fan-out package structure having a cavity formed thereon; disposing at least one die in the cavity of the fan-out package structure; after the at least one die is disposed in the cavity of the fan-out package structure, filling an adhesive in the cavity of the fan-out package structure to surround the at least one die, wherein the adhesive has a coefficient of thermal expansion (CTE) that is smaller than 10 ppm/° C.; hardening the filled adhesive to fix the at least one die in the cavity of the fan-out package structure; forming a molding compound over the fan-out package structure; and removing the carrier. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the at least one die has metal pads formed thereon, and the metal pads are positioned to face the carrier when the at least one die is disposed in the cavity of the fan-out package structure. ### Claim 3 (depends on 2) The method as claimed in claim 2, further comprising: forming a redistribution layer to electrically connect the metal pads; and disposing solder balls on the redistribution layer. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein the filled adhesive is hardened by heating. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein the at least one die comprises stacking dies disposed in the cavity of the fan-out package structure. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the adhesive is an epoxy adhesive or is mixed with glass powder. ### Claim 7 A method of forming a semiconductor package, comprising: attaching a fan-out package structure to a first carrier, the fan-out package structure having a cavity formed thereon; disposing at least one die in the cavity of the fan-out package structure; after the at least one die is disposed in the cavity of the fan-out package structure, filling an adhesive in the cavity of the fan-out package structure to surround the at least one die, wherein the adhesive has a coefficient of thermal expansion (CTE) that is smaller than 10 ppm/° C.; hardening the filled adhesive to fix the at least one die in the cavity of the fan-out package structure, wherein a first package comprising the fan-out package structure and the at least one die is formed, the first package having opposing first surface and second surface, the second surface being attached to the first carrier; removing the first carrier; attaching the first surface of the first package on a second carrier; forming a molding compound over the first package; and removing the second carrier. ### Claim 8 (depends on 7) The method as claimed in claim 7, wherein the at least one die has metal pads formed thereon, and the metal pads are positioned to face the first carrier when the at least one die is placed in the cavity of the fan-out package structure. ### Claim 9 (depends on 8) The method as claimed in claim 8, wherein the molding compound covers the metal pads, the method comprising: removing at least a portion of the molding compound to expose the metal pads out. ### Claim 10 (depends on 9) The method as claimed in claim 9, further comprising: forming a redistribution layer to electrically connect the metal pads; and disposing solder balls on the redistribution layer. ### Claim 11 (depends on 7) The method as claimed in claim 7, wherein the filled adhesive is hardened by heating. ### Claim 12 (depends on 7) The method as claimed in claim 7, wherein the at least one die comprises stacking dies disposed in the cavity of the fan-out package structure. ### Claim 13 (depends on 7) The method as claimed in claim 7, wherein the adhesive is an epoxy adhesive or is mixed with glass powder.