# US 10,504,830 B2 · Chip-on-film package, display panel, and display device

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- Number: US 10,504,830 B2
- Document ID: US10504830B2
- Status: Granted
- Kind: B2
- Application number: 15/857,744
- Filed: 2017-12-29
- Published: 2018-08-16
- Granted: 2019-12-10
- Earliest claimed: 2017-02-10
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Hee-Kwon Lee; Seungkyun Hong
- Web page: https://patentgrep.com/patent/US10504830B2

## CPC

- G09G 3/006: {Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309)}
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- G09G 3/20: for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix {no fixed position being assigned to or needed to be assigned to the individual characters or partial characters}
- H05K 1/0268: {for electrical inspection or testing}
- H10W 20/484: {Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes}
- H10W 70/688: {Flexible insulating substrates}
- H10W 74/129: {forming a chip-scale package [CSP]}
- G09G 2300/0413: Details of dummy pixels or dummy lines in flat panels
- G09G 2300/0426: Layout of electrodes and connections
- G09G 2330/12: Test circuits or failure detection circuits included in a display system, as permanent part thereof
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/10128: Display
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.

## Claims

### Claim 1

A chip-on-film package comprising:
a base substrate on which a first pad region extends on a first side defining one side of the base substrate, a second pad region different from the first pad region extending on a second side opposite the first side defining an opposite side to the one side of the base substrate, and a third region located between the first pad region and the second pad region are defined;
a dummy pad disposed on the first pad region;
a plurality of input pads disposed on the first pad region;
a plurality of output pads disposed on the second pad region in a single row;
a first detection line disposed on the base substrate, wherein the first detection line includes a first sub-detection line connected between a first input pad of the input pads and a first output pad of the output pads and a second sub-detection line connected between a second input pad of the input pads and a second output pad of the output pads, the first sub detection line being connected to the second sub-detection line in the second pad region to form a first loop between the first input pad and the second input pad; and
a second detection line disposed on the base substrate, wherein the second detection line is connected between the dummy pad and the first detection line, the second detection line being connected to the first sub-detection line in the third region to form a second loop between the dummy pad and the first input pad.

### Claim 2 (depends on 1)

The chip-on-film package of claim 1, wherein the dummy pad comprises an alignment key for alignment of the input pads.

### Claim 3 (depends on 1)

The chip-on-film package of claim 1, wherein
the first sub-detection line is connected to the second sub-detection line through a short pad in the second pad region.

### Claim 4 (depends on 1)

The chip-on-film package of claim 1, wherein the second detection line comprises a detection pattern disposed on the third region in a zigzag pattern.

### Claim 5 (depends on 1)

The chip-on-film package of claim 1, wherein the dummy pad is located in outermost among the input pads and the dummy pad disposed on the first pad region.

### Claim 6 (depends on 1)

The chip-on-film package of claim 1, further comprising:
an integrated circuit chip connected to the dummy pad and the input pads,
wherein the integrated circuit chip calculates a first resistance value of the first loop and a second resistance value of the second loop and determines whether at least one of the second pad region and the third region is damaged based on the first resistance value and the second resistance value.

### Claim 7 (depends on 6)

The chip-on-film package of claim 6, wherein
the integrated circuit chip determines whether the second pad region and the third region are damaged based on an input pad resistance value of the input pads and the first resistance value,
the integrated circuit chip determines whether the third region is damaged based on the input pad resistance value and the second resistance value, and
the integrated circuit chip determines whether the second pad region is damaged based on a difference value between the first resistance value and the second resistance value.

### Claim 8

A chip-on-film package comprising: a base substrate on which a first pad region extends on a first side defining one side of the base substrate, a second pad region different from the first pad region extending on a second side opposite the first side defining an opposite side to the one side of the base substrate, and a third region located between the first pad region and the second pad region are defined;
a dummy pad disposed on the first pad region;
a plurality of input pads disposed on the first pad region;
a plurality of output pads disposed on the second pad region in a single row;
a first detection line disposed on the base substrate, wherein the first detection line includes a first sub-detection line connected between a first input pad of the input pads and a first output pad of the output pads and a second sub-detection line connected between a second input pad of the input pads and a second output pad of the output pads, the first sub-detection line being connected to the second sub-detection line in the second pad region; and
a second detection line disposed on the base substrate, the second detection line is connected between the dummy pad and the first detection line in the third region.

### Claim 9 (depends on 8)

The chip-on-film package of claim 8, wherein
the first sub-detection line is connected to the second sub-detection line through a short pad in the second pad region.

### Claim 10 (depends on 8)

The chip-on-film package of claim 8, further comprising:
an inspection circuit is connected to the dummy pad and the input pads,
wherein the inspection circuit calculates a first resistance value between the first input pad and the second input pad and a second resistance value between the dummy pad and the first input pad, and the inspection circuit determines whether at least one of the second pad region and the third region is damaged based on the first resistance value and the second resistance value.

### Claim 11 (depends on 10)

The chip-on-film package of claim 10, wherein
the inspection circuit determines whether the second pad region and the third region are damaged based on an input pad resistance value of the input pads and the first resistance value,
the inspection circuit determines whether the third region is damaged based on the input pad resistance value and the second resistance value, and
the inspection circuit determines whether the second pad region is damaged based on a difference value between the first resistance value and the second resistance value.