Integrated circuit package and method

A method comprising:

• attaching a first integrated circuit device and a second integrated circuit device to a first surface of an interposer, the first integrated circuit device and the second integrated circuit device being separated by a gap, wherein the interposer electrically couples the first integrated circuit device to the second integrated circuit device after the attaching;
• forming a dam in the gap;
• forming an underfill on the interposer, the underfill having a first portion beneath the first integrated circuit device, the underfill having a second portion beneath the second integrated circuit device, the dam physically separating the first portion from the second portion;
• removing the dam to form an opening exposing the interposer;
• and
• encapsulating the first integrated circuit device and the second integrated circuit device with an encapsulant, the encapsulant being disposed in the opening.

A package comprising:

• a substrate having a first surface and a second surface opposite the first surface;
• a through via extending from the first surface of the substrate to the second surface of the substrate;
• an interconnect structure disposed at the first surface of the substrate, the interconnect structure being electrically coupled to the through via;
• a first integrated circuit device attached to the interconnect structure;
• a second integrated circuit device attached to the interconnect structure;
• an underfill disposed beneath the first integrated circuit device and the second integrated circuit device;
• and
• an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.