# US 10,504,820 B2 · Semiconductor module and electric power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,820 B2 - Document ID: US10504820B2 - Status: Granted - Kind: B2 - Application number: 16/316,419 - Filed: 2016-10-21 - Published: 2019-09-26 - Granted: 2019-12-10 - Earliest claimed: 2016-10-21 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Tatsuya Kawase; Yosuke Nakata; Yuji Imoto; Osamu Usui - Web page: https://patentgrep.com/patent/US10504820B2 ## CPC - H05K 7/20927: {Liquid coolant without phase change} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 7/5387: in a bridge configuration - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H10W 90/00: Package configurations - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of fins (6) are provided on a lower surface of the conductive base plate (1). A heat dissipating base plate (7) is provided to tips of the plurality of fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in a bottom surface surrounds the plurality of fins (6) and the heat dissipating base plate (7). A partition (10) separates a space surrounded by the cooler (8) and the heat dissipating base plate (7) into an inflow-side space (11a) connected to the inflow port (9a) and an outflow-side space (11b) connected to the outflow port (9b). A first slit (12a) is provided in a central portion of the heat dissipating base plate (7). Second and third slits (12b,12c) are respectively provided on both sides of the heat dissipating base plate (7) along a direction from an inflow side to an outflow side. One of the first slit (12a) and the second and third slits (12b,12c) is an inflow-side slit connected to the inflow-side space (11a) and the other is an outflow-side slit connected to the outflow-side space (11b). ## Claims ### Claim 1 A semiconductor module comprising: a conductive base plate; an insulating substrate provided on an upper surface of the conductive base plate; a conductive pattern provided on the insulating substrate; a plurality of semiconductor devices provided on the conductive pattern; a plurality of fins provided on a lower surface of the conductive base plate; a heat dissipating base plate provided to tips of the plurality of fins; a cooler provided so as to surround the plurality of fins and the heat dissipating base plate and having an inflow port and an outflow port provided in a bottom surface of the cooler; and a partition separating a space surrounded by the cooler and the heat dissipating base plate into an inflow-side space connected to the inflow port and an outflow-side space connected to the outflow port, wherein a first slit is provided in a central portion of the heat dissipating base plate, second and third slits are respectively provided on both sides of the heat dissipating base plate along a direction from an inflow side to an outflow side, and one of the first slit and the second and third slits is an inflow-side slit connected to the inflow-side space and the other is an outflow-side slit connected to the outflow-side space. ### Claim 2 (depends on 1) The semiconductor module according to claim 1, wherein the plurality of semiconductor devices includes a first semiconductor device and a second semiconductor device having a larger calorific value than the first semiconductor device, and the second semiconductor device is arranged closer to the inflow-side slit than the first semiconductor device. ### Claim 3 (depends on 2) The semiconductor module according to claim 2, wherein the second and third slits are the inflow-side slit, and the second semiconductor device is disposed above the second and third slits. ### Claim 4 (depends on 2) The semiconductor module according to claim 2, wherein the first slit is the inflow-side slit, and the second semiconductor device is disposed above the first slit. ### Claim 5 (depends on 1) The semiconductor module according to claim 1, wherein an inflow-side fin of the plurality of fins has a shape which makes it more difficult for cooling water to pass through the inflow-side fin than an outflow-side fin. ### Claim 6 (depends on 5) The semiconductor module according to claim 5, wherein the inflow-side fin has a higher fin density than the outflow-side fin. ### Claim 7 (depends on 5) The semiconductor module according to claim 5, wherein a shape of the plurality of fins is a radial elliptic arc having a center on the inflow side. ### Claim 8 (depends on 1) The semiconductor module according to claim 1, wherein a blow-by structure, which is free of the plurality of fins and the heat dissipating base plate, is provided above the inflow port and the outflow port. ### Claim 9 (depends on 1) The semiconductor module according to claim 1, wherein the plurality of semiconductor devices are made of a wide-band-gap semiconductor. ### Claim 10 (depends on 1) An electric power conversion device comprising: a main conversion circuit including the semiconductor module according to claim 1, converting input power and outputting converted power; and a control circuit outputting a control signal for controlling the main conversion circuit to the main conversion circuit.