# US 10,504,817 B2 · Semiconductor device

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- Number: US 10,504,817 B2
- Document ID: US10504817B2
- Status: Granted
- Kind: B2
- Application number: 16/004,769
- Filed: 2018-06-11
- Published: 2019-03-07
- Granted: 2019-12-10
- Earliest claimed: 2017-09-06
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Kazuya Okada; Hiroki Muraoka; Koichi Masuda; Yasutaka Shimizu; Shoji Izumi
- Web page: https://patentgrep.com/patent/US10504817B2

## CPC

- H10W 40/611: {Bolts or screws}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/77: Auxiliary members characterised by their shape
- H10W 76/12: characterised by their shape
- H10W 76/161: {Containers comprising no base}
- H10W 40/233: {attached to chips}
- H10W 40/242: {comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders}
- H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a technique for improving product attachment. In a semiconductor device, the following expression is satisfied by an angle A formed by an imaginary line connecting two attachment holes together and an imaginary line connecting together a lowest point of one of two projections positioned in a surrounding portion of one of the two attachment holes and a contact point between a bulge and a heat sink, with a screw fastened to the heat sink through the one attachment hole, where M represents a vertical direction between the lower end of a body and the lower end of a case, where W represents a bulge amount of the bulge, where T represents a height of the projection, where L represents a horizontal distance from the outer peripheral end of the case to the outer peripheral end of the heat dissipation plate: 0<A<arctan((M+W−T)/L).

## Claims

### Claim 1

A semiconductor device comprising:
a heat sink;
a heat dissipation plate disposed above the heat sink;
a semiconductor element disposed above the heat dissipation plate; and
a case enclosing the semiconductor element and attached to the heat sink,
wherein the heat dissipation plate has
a body being flat shaped, and
a bulge bulging out from a lower end of the body in a form of an arc in cross-sectional view,
wherein the case has
an attachment portion extending outward from an outer periphery portion at a lower end portion of the case,
two attachment holes disposed in positions opposite to each other in the attachment portion, and provided for attachment to the heat sink, and
two projections individually projecting downward from a lower surface of the attachment portion in positions more adjacent to an outer periphery side of the attachment portion than the two attachment holes, and
wherein the following expression is satisfied by an angle A formed by an imaginary line connecting the two attachment holes together and an imaginary line connecting together a lowest point of one of the two projections positioned in a surrounding portion of one of the two attachment holes and a contact point between the bulge and the heat sink, with a screw fastened to the heat sink through the one attachment hole, where M represents a vertical distance between the lower end of the body and the lower end of the case, where W represents a bulge amount of the bulge, where T represents a height of the projection, where L represents a horizontal distance from an outer peripheral end of the case to an outer peripheral end of the heat dissipation plate:
0<A<arctan((M+W−T)/L).

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein the projections are each provided for the attachment hole in a single form or a plural form.

### Claim 3 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have a cutout on an attachment hole side.

### Claim 4 (depends on 2)

The semiconductor device according to claim 2, wherein the projections are each made of the same material as the case and each provided to be integral with the case.

### Claim 5 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have an inclined portion inclined toward an attachment hole side with respect to the lower surface of the attachment portion so as to have a smaller width in a distal end of the projections than in a proximal end of the projections.

### Claim 6 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have a curved surface portion dented toward an attachment hole side in a form of a curved surface.

### Claim 7 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have a hollow extending in a vertical direction.

### Claim 8 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have a hollow extending in a horizontal direction.

### Claim 9 (depends on 2)

The semiconductor device according to claim 2, wherein the projections each have a plurality of grooves extending in a vertical direction.

### Claim 10 (depends on 1)

The semiconductor device according to claim 1, wherein one of the projections directly contacts the heat sink and is configured to support the case and the heat dissipation plate above the heat sink.

### Claim 11 (depends on 1)

The semiconductor device according to claim 1, wherein the projections are each spatially separated from the heat dissipation plate.