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US 10,504,814 B2Granted
Variable pin fin construction to facilitate compliant cold plates
AssigneeInternational Business Machines Corporation
InventorMark Delorman Schultz
Life of this patent
Estimating the term…
Abstract
A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.
Claims20
An apparatus, comprising:
- a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises:
- a first active region comprising first pin portions positioned in a first planar arrangement having first links connecting some of the first pin portions, and
- a second active region comprising second pin portions positioned in a second planar arrangement having second links connecting some of the second pin portions, wherein the second planar arrangement is different from the first planar arrangement, the difference comprising the first planar arrangement having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second planar arrangement;
- and
- a conformable layer adjacent to at least one of the plurality of layers.
2 more elements
An apparatus, comprising:
- a plurality of layers adapted to couple to a load or heat source, wherein the plurality of layers are bonded in a stacked configuration and comprise:
- a first active region comprising first pin portions positioned in a first planar arrangement having first links connecting some of the first pin portions,
- a second active region comprising second pin portions positioned in a second planar arrangement having second links connecting some of the second pin portions, wherein the second planar arrangement is different from the first planar arrangement, the difference comprising the first planar arrangement having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second planar arrangement;
- and
- a conformable layer adjacent to one or more of the plurality of layers.
2 more elements
A method comprising:
- providing a plurality of layers comprising a plurality of respective pin portions, wherein the providing the plurality of layers comprises:
- configuring a first plurality of first pin portions of a first layer, of the plurality of layers, according to a first configuration having first links connecting some of the first pin portions;
- and
- configuring a second plurality of second pin portions of a second layer, of the plurality of layers, according to a second configuration having second links connecting some of the second pin portions, wherein the second configuration is different from the first configuration, the difference comprising the first configuration having a first ratio of the first pin portions to the first links that is different than a second ratio of the second pin portions to the second links of the second configuration;
- aligning the first plurality of first pin portions adjacent to the second plurality of second pin portions;
- stacking the plurality of layers according to the aligning, resulting in adjacent layers;
- and
- bonding the adjacent layers and a conformable layer to form a stack of bonded layers, wherein the first plurality of first pin portions and the second plurality of second pin portions form columns of pin fins.
5 more elements
Dependencies are inferred from the claim text.