# US 10,504,808 B2 · Semiconductor module having improved stud bolt configurations

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,504,808 B2
- Document ID: US10504808B2
- Status: Granted
- Kind: B2
- Application number: 15/660,993
- Filed: 2017-07-27
- Published: 2018-07-12
- Granted: 2019-12-10
- Earliest claimed: 2017-01-12
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Fumihito Kawahara; Koji Yamada
- Web page: https://patentgrep.com/patent/US10504808B2

## CPC

- H10W 76/60: Seals
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor module includes a case. The case includes a bottom part, a case frame, and a case lid. An inner electrode and a stud bolt are provided inside the case. A head part of the stud bolt is tapered, and a tubular part has an inner diameter that increases downward so as to keep a constant distance from the sides of the head part. With this structure, even if the stud bolt is pulled up, the tubular part can hold down the head part. Therefore, the stud bolt can be prevented from being loosened or detached by the force applied from a terminal fixing screw when an external connection terminal is attached or removed.

## Claims

### Claim 1

A semiconductor module, comprising:
a bottom part configured to constitute a bottom surface of a case accommodating a semiconductor device, the bottom part having an upper face on which the semiconductor device is mounted;
an inner electrode including an electrode plate portion provided above the bottom part, and a connecting portion configured to electrically connect the electrode plate portion and the semiconductor device, the electrode plate portion being provided with a first through hole penetrating the electrode plate portion in a thickness direction thereof;
a case frame including an annular frame part and a plate-like protrusion protruding in the form of a plate from an inner wall of the frame part, the frame part having a lower end portion connected to a peripheral portion of the bottom part, the plate-like protrusion overlapping the electrode plate portion, the plate-like protrusion being provided with a second through hole communicating with the first through hole;
a stud bolt including, at one end thereof, a threaded part having a first series of threads, and including, at the other end thereof, a head part having a tapered shape with a larger diameter than that of the threaded part, the head part being provided with a threaded hole having a second series of threads in an inner wall thereof, the threaded part being screwed in the first through hole; and
a case lid including a flat plate part mounted to an upper end portion of the frame part and provided with a third through hole directly above the head part, and a tubular part protruding downward from a periphery of the third through hole in the flat plate part to surround sides of the head part and having an inner diameter that increases downward,
an adhesive being provided in a gap between the head part and the tubular part.

### Claim 2 (depends on 1)

The semiconductor module according to claim 1, wherein the head part is tapered.

### Claim 3 (depends on 2)

The semiconductor module according to claim 2, wherein the tubular part has an inner diameter that increases gradually downward so as to keep a constant distance from the sides of the head part.

### Claim 4 (depends on 1)

The semiconductor module according to claim 1, wherein the head part has a diameter that decreases stepwise.

### Claim 5 (depends on 4)

The semiconductor module according to claim 4, wherein the tubular part has an inner diameter that increases stepwise downward so as to keep a constant distance between an inner circumferential surface of the tubular part and the sides of the head part.

### Claim 6 (depends on 1)

The semiconductor module according to claim 1, further comprising a washer fitted to the threaded part and sandwiched between the head part and the plate-like protrusion.