# US 10,504,804 B2 · Laser processing method, substrate dicing method and substrate processing system for performing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,804 B2 - Document ID: US10504804B2 - Status: Granted - Kind: B2 - Application number: 16/039,622 - Filed: 2018-07-19 - Published: 2019-05-02 - Granted: 2019-12-10 - Earliest claimed: 2017-10-27 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Jin-Yeol Yang; Hyung-Su Son; Hae-Gu Lee; Dong-Su Han - Web page: https://patentgrep.com/patent/US10504804B2 ## CPC - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/03: Observing, e.g. monitoring, the workpiece - B23K 26/0622: by shaping pulses - B23K 26/0861: {in at least three axial directions} - B23K 26/359: by providing a line or line pattern, e.g. a dotted break initiation line - B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks - G01N 23/20: by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - B23K 2101/40: Semiconductor devices - B23K 2103/56: {being semiconducting} - H10P 50/20: Dry etching; Plasma etching; Reactive-ion etching - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7416: {used during dicing or grinding} - H10P 72/742: {involving stretching of the auxiliary support post dicing} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) ## Abstract A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray. ## Claims ### Claim 1 A laser processing method, the method comprising: irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate; irradiating an X-ray onto a first surface of the substrate along the cutting line; obtaining an image of a diffracted X-ray from the substrate; and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray. ### Claim 2 (depends on 1) The laser processing method as claimed in claim 1, wherein forming the laser-scribed layer includes moving at least one of the laser light and the substrate relatively to each other along the cutting line. ### Claim 3 (depends on 1) The laser processing method as claimed in claim 1, wherein obtaining the image of the diffracted X-ray from the substrate includes obtaining a transmission X-ray topographic image from a second surface of the substrate opposite to the first surface. ### Claim 4 (depends on 3) The laser processing method as claimed in claim 3, wherein obtaining the image of the diffracted X-ray from the substrate further includes obtaining a reflection X-ray topographic image from the first surface of the substrate. ### Claim 5 (depends on 1) The laser processing method as claimed in claim 1, wherein obtaining the image of the diffracted X-ray from the substrate includes obtaining a reflection X-ray topographic image from the first surface of the substrate. ### Claim 6 (depends on 1) The laser processing method as claimed in claim 1, wherein irradiating the X-ray onto the first surface of the substrate includes irradiating the X-ray while changing an incident angle of the X-ray at a same detection region. ### Claim 7 (depends on 6) The laser processing method as claimed in claim 6, wherein obtaining the image of the diffracted X-ray from the substrate includes obtaining a 3-dimensional image of the laser-scribed layer from a plurality of X-ray images at different incident angles. ### Claim 8 (depends on 1) The laser processing method as claimed in claim 1, wherein determining whether or not the laser-scribed layer is formed includes measuring a size and a position of the laser-scribed layer from the obtained image of the diffracted X-ray. ### Claim 9 (depends on 1) The laser processing method as claimed in claim 1, wherein irradiating the X-ray includes moving at least one of the X-ray and the substrate relatively to each other along the cutting line. ### Claim 10 (depends on 1) The laser processing method as claimed in claim 1, further comprising grinding the first surface of the substrate. ### Claim 11 A substrate dicing method, the method comprising: irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate; irradiating an X-ray onto a first surface of the substrate along the cutting line; obtaining an image of a diffracted X-ray from the substrate; determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray; and grinding the first surface of the substrate. ### Claim 12 (depends on 11) The substrate dicing method as claimed in claim 11, further comprising forming a protection tape on a second surface of the substrate opposite to the first surface, before irradiating the laser light. ### Claim 13 (depends on 11) The substrate dicing method as claimed in claim 11, wherein forming the laser-scribed layer includes moving at least one of the laser light and the substrate relatively to each other along the cutting line. ### Claim 14 (depends on 13) The substrate dicing method as claimed in claim 13, wherein obtaining the image of the diffracted X-ray from the substrate includes obtaining a transmission X-ray topographic image from a second surface of the substrate opposite to the first surface. ### Claim 15 (depends on 14) The substrate dicing method of claim 14, wherein obtaining the image of the diffracted X-ray from the substrate further includes obtaining a reflection X-ray topographic image from the first surface of the substrate. ### Claim 16 (depends on 11) The substrate dicing method as claimed in claim 11, wherein irradiating the X-ray onto the first surface of the substrate includes irradiating the X-ray while changing an incident angle of the X-ray at a same detection region. ### Claim 17 (depends on 11) The substrate dicing method as claimed in claim 11, wherein obtaining the image of the diffracted X-ray from the substrate includes obtaining a 3-dimensional image of the laser-scribed layer from a plurality of X-ray images at different incident angles. ### Claim 18 (depends on 11) The substrate dicing method as claimed in claim 11, wherein irradiating the X-ray includes moving at least one of the X-ray and the substrate relatively to each other along the cutting line. ### Claim 19 (depends on 11) The substrate dicing method as claimed in claim 11, wherein determining whether or not the laser-scribed layer is formed includes measuring a size and a position of the laser-scribed layer from the obtained image of the diffracted X-ray. ### Claim 20 (depends on 11) The substrate dicing method as claimed in claim 11, further comprising: adhering an adhesive tape sheet onto the first surface of the substrate; and expanding the adhesive tape sheet along the cutting line to dice the substrate into individual chips.