# US 10,504,783 B2 · Laser processing apparatus

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- Number: US 10,504,783 B2
- Document ID: US10504783B2
- Status: Granted
- Kind: B2
- Application number: 16/172,987
- Filed: 2018-10-29
- Published: 2019-05-02
- Granted: 2019-12-10
- Earliest claimed: 2017-11-02
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Keiji Nomaru; Yuji Hadano
- Web page: https://patentgrep.com/patent/US10504783B2

## CPC

- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less}
- B23K 26/146: the fluid stream containing a liquid
- B23K 26/1462: {Nozzles; Features related to nozzles}
- B23K 26/1464: {Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/40: taking account of the properties of the material involved
- H10P 72/74: {using temporarily an auxiliary support}
- B23K 26/0643: {comprising mirrors}
- B23K 2101/40: Semiconductor devices
- H10P 72/7416: {used during dicing or grinding}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A laser processing apparatus has a liquid supply mechanism disposed at an upper portion of a holding unit. The liquid supply mechanism includes: a pool adapted to form a layer of a liquid on an upper surface of a workpiece held by a holding table; a transparent plate disposed such as to make contact with the layer of the liquid; a jet nozzle adapted to jet the liquid by positioning a jet port between an upper surface of the workpiece and the transparent plate toward an application position of a laser beam applied to the workpiece through the transparent plate; a liquid supply nozzle adapted to supply the liquid from one side of the pool; and a liquid discharge nozzle adapted to discharge the liquid from the other side of the pool.

## Claims

### Claim 1

A laser processing apparatus comprising:
a holding unit including a holding table adapted to hold a plate-shaped workpiece;
a laser beam applying unit adapted to apply a laser beam to the workpiece held by the holding table to process the workpiece; and
a liquid supply mechanism disposed on the holding unit,
wherein the liquid supply mechanism includes:
a pool adapted to form a layer of a liquid on an upper surface of the workpiece held by the holding table;
a transparent plate disposed such as to make contact with the layer of the liquid;
a jet nozzle adapted to jet the liquid toward an application position of the laser beam applied to the workpiece through the transparent plate;
a liquid supply nozzle adapted to supply the liquid from one side of the pool; and
a liquid discharge nozzle adapted to discharge the liquid from other side of the pool.

### Claim 2 (depends on 1)

The laser processing apparatus according to claim 1, wherein the laser beam applying unit includes dispersing means dispersing the laser beam emitted from a laser oscillator.