# US 10,504,778 B2 · Composite contact plug structure and method of making same

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- Number: US 10,504,778 B2
- Document ID: US10504778B2
- Status: Granted
- Kind: B2
- Application number: 16/216,585
- Filed: 2018-12-11
- Published: 2019-04-11
- Granted: 2019-12-10
- Earliest claimed: 2014-04-30
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Yu-Hung Lin; Sheng-Hsuan Lin; Chih-Wei Chang; You-Hua Chou; Chia-Lin Hsu
- Web page: https://patentgrep.com/patent/US10504778B2

## CPC

- H10W 20/036: {the barrier, adhesion or liner layers being within a main fill metal}
- H10D 64/0112: {using conductive layers comprising silicides}
- H10D 64/01125: {the silicides being formed by chemical reaction with the semiconductor after the contact hole formation}
- H10W 20/033: {in openings in dielectrics}
- H10W 20/035: {combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers}
- H10W 20/047: {by introducing additional elements therein}
- H10W 20/081: {by forming openings in the dielectric parts}
- H10W 20/097: {by thermally treating}
- H10W 20/40: Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W 20/42: Vias, e.g. via plugs
- H10W 20/425: {Barrier, adhesion or liner layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

An embodiment contact plug includes a bilayer structure and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. The bilayer structure includes a conductive core and a conductive liner on a sidewall and a bottom surface of the conductive core. In the embodiment contact plug, the conductive liner comprises cobalt or ruthenium.

## Claims

### Claim 1

A device comprising:
a semiconductor substrate;
a silicide region in the semiconductor substrate;
a dielectric layer over the semiconductor substrate;
a conductive film extending through the dielectric layer; and
a contact plug extending through the dielectric layer to the silicide region, wherein the contact plug comprises:
a diffusion barrier layer contacting and having a different material composition than the conductive film, the conductive film is disposed between the diffusion barrier layer and the dielectric layer, the diffusion barrier layer further contacting the silicide region;
a conductive liner contacting a sidewall and a top surface of the diffusion barrier layer, the conductive liner comprises cobalt or ruthenium, and the conductive liner has a different material composition than the diffusion barrier layer; and
a conductive core contacting a sidewall and a top surface of the conductive liner, the conductive core has a different material composition than the conductive liner.

### Claim 2 (depends on 1)

The device of claim 1, wherein the conductive film does not extend below the diffusion barrier layer.

### Claim 3 (depends on 1)

The device of claim 1, wherein the conductive liner extends a first distance from a bottom surface of the conductive core to the top surface of the diffusion barrier layer, the conductive liner extends a second distance from the sidewall of the diffusion barrier layer to a sidewall of the conductive core, and wherein the second distance is less than the first distance.

### Claim 4 (depends on 3)

The device of claim 3, wherein the diffusion barrier layer extends a third distance from a bottom surface of the conductive liner to the silicide region, wherein the third distance is less than the second distance.

### Claim 5 (depends on 3)

The device of claim 3, wherein the second distance is disposed at the bottom surface of the conductive core.

### Claim 6 (depends on 1)

The device of claim 1, wherein the conductive film comprises titanium, cobalt, nickel, or tungsten.

### Claim 7 (depends on 1)

The device of claim 1, wherein the conductive core comprises tungsten, cobalt, or ruthenium.

### Claim 8 (depends on 1)

The device of claim 1, wherein the conductive liner is at least ten times thinner along a sidewall of the conductive core than along a bottom surface of the conductive core.

### Claim 9

A semiconductor device comprising:
a dielectric layer;
a contact plug in the dielectric layer, the contact plug comprising:
a conductive core;
a conductive liner forming interfaces with sidewalls and a bottom surface of the conductive core, the conductive liner under the conductive core having a first thickness measured between opposing lateral surfaces of the conductive liner, the conductive liner along a sidewall of the conductive core having a second thickness measured between opposing sidewalls of the conductive liner, and the first thickness is at least ten times the second thickness; and
a diffusion barrier layer between the conductive liner and the dielectric layer; and
a silicide region under the dielectric layer, wherein the contact plug extends to the silicide region.

### Claim 10 (depends on 9)

The semiconductor device of claim 9 further comprising a conductive film between the diffusion barrier layer and the dielectric layer, wherein the conductive film and the silicide region each comprise a common material.

### Claim 11 (depends on 10)

The semiconductor device of claim 10, wherein the conductive film has a third thickness measured between opposing sidewalls of the conductive film, and wherein the third thickness is in the range of 3 Å to 30 Å.

### Claim 12 (depends on 9)

The semiconductor device of claim 9, wherein diffusion barrier layer forms an interface with the silicide region.

### Claim 13 (depends on 9)

The semiconductor device of claim 9, wherein the conductive core comprises tungsten, ruthenium, or cobalt, and wherein the conductive liner comprises cobalt or ruthenium, and wherein the diffusion barrier layer comprises tantalum or tantalum nitride.

### Claim 14 (depends on 9)

The semiconductor device of claim 9, wherein the first thickness is in the range of 100 Å to 2000 Å, and wherein the second thickness is in the range of 100 Å to 200 Å.

### Claim 15 (depends on 9)

The semiconductor device of claim 9, wherein the diffusion barrier layer has a fourth thickness under the conductive liner and third thickness on a sidewall of the conductive liner, and wherein the fourth thickness is in the range of 5 Å to 100 Å.

### Claim 16 (depends on 9)

The semiconductor device of claim 9, wherein the conductive core has a fifth thickness measured between opposing lateral surfaces of the conductive core, and wherein the fifth thickness is in the range of 100 Å to 2000 Å.

### Claim 17

A method for forming a contact plug, the method comprising:
patterning an opening in a dielectric layer, the opening exposing a portion of a substrate;
depositing a conductive film on sidewalls and a bottom surface of the opening;
depositing a diffusion barrier layer in the opening over the conductive film;
depositing a conductive liner in the opening over the diffusion barrier layer;
depositing a conductive core in the opening over the conductive liner, wherein the conductive core and the conductive liner have different material compositions; and
performing an anneal to form a silicide at the portion of the substrate, wherein performing the anneal completely consumes a first portion of the conductive film under the diffusion barrier layer while leaving a second portion of the conductive film between a sidewall of the diffusion barrier layer and the dielectric layer.

### Claim 18 (depends on 17)

The method of claim 17, wherein depositing the conductive liner comprises depositing cobalt or ruthenium, and depositing the conductive core comprises depositing cobalt, ruthenium, or tungsten.

### Claim 19 (depends on 17)

The method of claim 17, further comprising after performing the anneal, planarizing portions of the diffusion barrier layer, conductive liner, and conductive core disposed over a topmost surface of the dielectric layer.

### Claim 20 (depends on 17)

The method of claim 17, wherein the conductive liner is thinner along the sidewall of the diffusion barrier layer than along a bottom surface of the diffusion barrier layer.