# US 10,504,748 B2 · Method of packaging a power amplifier module having a unified pattern and ceramic sidewall

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- Number: US 10,504,748 B2
- Document ID: US10504748B2
- Status: Granted
- Kind: B2
- Application number: 14/854,098
- Filed: 2015-09-15
- Published: 2017-02-09
- Granted: 2019-12-10
- Earliest claimed: 2015-08-07
- Assignees: Center for Integrated Smart Sensors Foundation
- Applicants: Center for Integrated Smart Sensors Foundation
- Inventors: Kyung Hak Lee; Min Seok Han; Young Ki Kim
- Web page: https://patentgrep.com/patent/US10504748B2

## CPC

- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H03F 3/21: with semiconductor devices only {(H03F3/245 takes precedence)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/103: {by bonding or embedding conductive wires or strips}
- H10W 76/134: having other interconnections parallel to the conductive base
- H10W 76/157: having interconnections parallel to the insulating or insulated base
- H10W 76/18: Insulating materials, e.g. resins, glasses or ceramics
- H10W 70/635: {Through-vias}
- H10W 70/692: Ceramics or glasses
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H03F: AMPLIFIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.

## Claims

### Claim 1

A method of packaging a power amplifier module, comprising:
providing a unified pattern comprising a ceramic layer and a pattern formed on and above the ceramic layer;
bonding the unified pattern on a metal layer;
depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, directly on and above and in physical contact with the ceramic layer included in the unified pattern bonded on the metal layer, wherein a hole is formed in the ceramic sidewall;
forming a metal line above the ceramic sidewall;
disposing an insulating layer between the ceramic sidewall and the metal line and between the at least one external signal connection lead line and the metal line;
forming at least one vertical via plug within the hole to thereby connect the at least one external signal connection lead line to the pattern, wherein the at least one external signal connection lead line is configured to connect to an external device; and
mounting a cover on the metal line formed on the ceramic sidewall deposited on the ceramic layer included in the unified pattern bonded on the metal layer;
wherein the metal layer includes at least one connection frame connecting the power amplifier module to an other module.

### Claim 2 (depends on 1)

The method of claim 1, wherein the bonding of the unified pattern comprises:
coating a metal coating layer on a surface of the metal layer; and
bonding the unified pattern on the surface on which the metal coating layer is coated.

### Claim 3 (depends on 1)

The method of claim 1, further comprising:
integrating a chip in a groove, which is formed on the ceramic layer included in the unified pattern, so as to be connected with the pattern.

### Claim 4 (depends on 1)

The method of claim 1, wherein the step of depositing comprises forming the at least one external signal connection lead line on a top surface of the ceramic sidewall.