# US 10,504,655 B2 · Composite electronic component and board having the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,504,655 B2
- Document ID: US10504655B2
- Status: Granted
- Kind: B2
- Application number: 15/644,178
- Filed: 2017-07-07
- Published: 2018-06-28
- Granted: 2019-12-10
- Earliest claimed: 2016-12-22
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Man Su Byun; Ho Yoon Kim; Dae Heon Jeong; Kyung Hwa Yu; Min Kyoung Cheon; Soo Hwan Son
- Web page: https://patentgrep.com/patent/US10504655B2

## CPC

- H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H02H 9/045: {adapted to a particular application and not provided for elsewhere}
- H05K 1/0213: {Electrical arrangements not otherwise provided for}
- H05K 1/0259: {Electrostatic discharge [ESD] protection}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/181: associated with surface mounted components
- H01G 4/008: Selection of materials
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10515: Stacked components
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H10W 42/60: protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60)
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H02H: EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS (indicating or signalling undesired working conditions G01R, e.g. G01R31/00, G08B; locating faults along lines G01R31/08; emergency protective devices H01H)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the capacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1<4.0 is satisfied, in which G1 is a distance between the internal electrodes adjacent to each other and G2 is a distance between the first and second lead electrodes.

## Claims

### Claim 1

A composite electronic component comprising:
a composite body in which a capacitor and an electrostatic discharge (ESD) protection device are coupled to each other,
the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layers interposed therebetween, are stacked, and
the ESD protection device including first and second lead electrodes disposed on the body of the capacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part;
an input terminal connected to the internal electrodes of the capacitor and the first lead electrode of the ESD protection device; and
a ground terminal connected to the internal electrodes of the capacitor and the second lead electrode of the ESD protection device,
wherein G2/G1<4.0, in which G1 is a distance, in a stacking direction of the internal electrodes, between the internal electrodes adjacent to each other and G2 is a distance, in a direction perpendicular to the stacking direction, between the first and second lead electrodes.

### Claim 2 (depends on 1)

The composite electronic component of claim 1, wherein 0.2<G2/G1<4.0.

### Claim 3 (depends on 1)

The composite electronic component of claim 1, wherein the ESD protection device is disposed on a lower surface of the capacitor body.

### Claim 4 (depends on 1)

The composite electronic component of claim 1, wherein the first and second lead electrodes face each other on the same plane.

### Claim 5 (depends on 1)

The composite electronic component of claim 1, wherein the discharge part includes a conductive polymer.

### Claim 6 (depends on 1)

The composite electronic component of claim 1, wherein the protection layer includes an epoxy-based resin.

### Claim 7 (depends on 1)

The composite electronic component of claim 1, wherein the composite body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other,
the internal electrodes include first and second internal electrodes alternately stacked to be exposed through the third and fourth surfaces of the composite body, respectively,
the input terminal is disposed on the third surface of the composite body and is connected to the first internal electrodes and the first lead electrode of the ESD protection device, and
the ground terminal is disposed on the fourth surface of the composite body and is connected to the second internal electrodes and the second lead electrode of the ESD protection device.

### Claim 8 (depends on 1)

The composite electronic component of claim 1, wherein a plating layer is disposed on the input terminal and the ground terminal.

### Claim 9 (depends on 1)

A board having a composite electronic component comprising:
a circuit board having a plurality of electrode pads formed on an upper part thereof;
the composite electronic component of claim 1 mounted on the circuit board; and
a solder connecting the electrode pads and the composite electronic component.

### Claim 10 (depends on 9)

The board having a composite electronic component of claim 9, wherein the ESD protection device is disposed between the solder and the capacitor of the composite electronic component.

### Claim 11 (depends on 1)

The composite electronic component of claim 1, wherein the first and second lead electrodes and the discharge part are disposed directly on a same surface of the capacitor.