# US 10,504,638 B2 · Thermistor and device using thermistor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,638 B2 - Document ID: US10504638B2 - Status: Granted - Kind: B2 - Application number: 16/061,658 - Filed: 2016-12-13 - Published: 2018-12-27 - Granted: 2019-12-10 - Earliest claimed: 2015-12-18 - Assignees: SEMITEC Corporation - Applicants: SEMITEC Corporation - Inventors: Katsuhiko Iwase - Web page: https://patentgrep.com/patent/US10504638B2 ## CPC - H01C 7/008: {Thermistors (H01C7/02 - H01C7/06 take precedence)} - G01K 7/22: the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) - H01C 1/14: Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors - H01C 7/04: having negative temperature coefficient - H01C: RESISTORS - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) ## Abstract Provided are a thermistor and a device using the thermistor by which ohmic contact can be ensured between electrodes formed on a thermistor composition and wiring lines connected to the electrodes, and by which high accuracy temperature detection is possible. A thermistor is provided with a thermistor composition, a pair of electrodes that are formed on the thermistor composition and that contain a noble metal, wires that are joined to the electrodes and that have a passivation film formed on a surface thereof, and a junction material that contains a noble metal oxide which joins the electrodes to the wires. ## Claims ### Claim 1 A thermistor, comprising: a thermistor composition; an electrode portion formed on the thermistor composition and containing a noble metal; a wiring bonded to the electrode portion and having an oxide film as a passivation film formed on a surface thereof; and a bonding material containing a noble metal oxide, disposed at least between the electrode portion and the wiring with ohmic contact to bond the wiring to the electrode portion. ### Claim 2 (depends on 1) The thermistor according to claim 1, wherein the electrode portion is formed by the bonding material. ### Claim 3 (depends on 1) The thermistor according to claim 1, wherein an atomic percentage of a noble metal oxide in a composition of the bonding material is 3 atm % to 60 atm %. ### Claim 4 (depends on 1) The thermistor according to claim 1, wherein the noble metal oxide in a composition of the bonding material is ruthenium oxide. ### Claim 5 (depends on 1) The thermistor according to claim 1, wherein a composition of the bonding material comprises at least silicon dioxide, zinc oxide, and aluminum oxide. ### Claim 6 (depends on 1) The thermistor according to claim 1, wherein a glass contained in a composition of the bonding material is crystallized glass. ### Claim 7 (depends on 1) The thermistor according to claim 1, wherein the electrode portion is covered with a protective layer of crystallized glass. ### Claim 8 (depends on 1) The thermistor according to claim 1, wherein a linear expansion coefficient of the thermistor composition is from 4.5×10−6/° C. to 10×10−6/° C., a linear expansion coefficient of the bonding material is from 5×10−6/° C. to 10×10−6/° C., and a linear expansion coefficient of the wiring is from 8×10−6/° C. to 14×10−6/° C. ### Claim 9 (depends on 1) The thermistor according to claim 1, wherein the wiring having the passivation film formed on the surface thereof is an iron-based alloy. ### Claim 10 (depends on 1) A device using a thermistor comprising the thermistor according to claim 1. ### Claim 11 (depends on 2) The thermistor according to claim 2, wherein an atomic percentage of a noble metal oxide in a composition of the bonding material is 3 atm % to 60 atm %. ### Claim 12 (depends on 2) The thermistor according to claim 2, wherein the noble metal oxide in a composition of the bonding material is ruthenium oxide. ### Claim 13 (depends on 3) The thermistor according to claim 3, wherein the noble metal oxide in a composition of the bonding material is ruthenium oxide. ### Claim 14 (depends on 2) The thermistor according to claim 2, wherein a composition of the bonding material comprises at least silicon dioxide, zinc oxide, and aluminum oxide. ### Claim 15 (depends on 3) The thermistor according to claim 3, wherein a composition of the bonding material comprises at least silicon dioxide, zinc oxide, and aluminum oxide. ### Claim 16 (depends on 4) The thermistor according to claim 4, wherein a composition of the bonding material comprises at least silicon dioxide, zinc oxide, and aluminum oxide. ### Claim 17 (depends on 2) The thermistor according to claim 2, wherein a glass contained in a composition of the bonding material is crystallized glass. ### Claim 18 (depends on 3) The thermistor according to claim 3, wherein a glass contained in a composition of the bonding material is crystallized glass. ### Claim 19 (depends on 4) The thermistor according to claim 4, wherein a glass contained in a composition of the bonding material is crystallized glass. ### Claim 20 (depends on 5) The thermistor according to claim 5, wherein a glass contained in a composition of the bonding material is crystallized glass.