# US 10,504,450 B2 · Micro light-emitting diode array substrate and display panel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,504,450 B2 - Document ID: US10504450B2 - Status: Granted - Kind: B2 - Application number: 15/521,658 - Filed: 2017-03-14 - Published: 2018-11-22 - Granted: 2019-12-10 - Earliest claimed: 2017-02-27 - Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd. - Applicants: Shenzhen China Star Optoelectronics Technology Co., Ltd. - Inventors: Lixuan Chen - Web page: https://patentgrep.com/patent/US10504450B2 ## CPC - G09G 3/34: by control of light from an independent source - H10D 64/62: Electrodes ohmically coupled to a semiconductor - H10H 20/80: Constructional details - H10H 20/8581: {characterised by their material} - H10W 90/00: Package configurations - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The disclosure provides a micro light-emitting diode array substrate, including a glass substrate. The glass substrate is formed with a gate electrode and a dielectric layer in sequence. The dielectric layer is formed with a semiconductor layer and a pixel electrode. The semiconductor layer is disposed with a source electrode and a drain electrode. The drain electrode and the adjacent pixel electrode are connected. The pixel electrode is connected with a micro light-emitting diode. The gate electrode, the source electrode, the drain electrode, the pixel electrode and a lead connected with a pin of the micro light-emitting diode are all made out of graphene conductive material. The disclosure further provides a display panel, including the micro LED array substrate. Micro LEDs are respectively disposed with color block layers. Compared with the prior art, heat of the micro light-emitting diodes can be transmitted to other regions for improving heat dissipation. ## Claims ### Claim 1 A micro light-emitting diode array substrate, comprising an array of micro light-emitting diodes arranged on a glass substrate, the glass substrate formed with a gate electrode and a dielectric layer in sequence, the dielectric layer formed with a semiconductor layer and a pixel electrode, the semiconductor layer disposed with a source electrode and a drain electrode, the drain electrode and the pixel electrode being connected with each other, the pixel electrode being connected with a respective one of the micro light-emitting diodes, wherein the gate electrode, the source electrode, the drain electrode, the pixel electrode and a pin of the micro light-emitting diode are connected through leads made of a graphene conductive material; wherein each of the micro light-emitting diodes comprises a color block layer arranged on a surface of the micro light-emitting diode to cover the surface of the micro light-emitting diode and a heat dissipation layer made of graphene is arranged between the surface of the micro light-emitting diode and the color block layer. ### Claim 2 A display panel, comprising a micro light-emitting diode array substrate, the micro light-emitting diode array substrate comprising an array of micro light-emitting diodes arranged on a glass substrate, the glass substrate formed with a gate electrode and a dielectric layer in sequence, the dielectric layer formed with a semiconductor layer and a pixel electrode, the semiconductor layer disposed with a source electrode and a drain electrode, the drain electrode and the pixel electrode being connected with each other, the pixel electrode being connected with a respective one of the micro light-emitting diodes, wherein the gate electrode, the source electrode, the drain electrode, the pixel electrode and a pin of the micro light-emitting diode are connected through leads made of a graphene conductive material, wherein each of the micro light-emitting diodes comprises a color block layer arranged on a surface of the micro light-emitting diode to cover the surface of the micro light-emitting diode and a heat dissipation layer made of graphene is arranged between the surface of the micro light-emitting diode and the color block layer. ### Claim 3 (depends on 2) The display panel according to claim 2, wherein the micro light-emitting diodes are blue micro light-emitting diodes, and the color block layers comprise a red color block layer and a green color block layer, the red color block layer and the green color block layer being respectively disposed above the micro light-emitting diodes to form a red subpixel and a green subpixel. ### Claim 4 (depends on 2) The display panel according to claim 2, wherein the color block layers are each made of a material containing quantum dots. ### Claim 5 (depends on 2) The display panel according to claim 2, wherein the color block layers comprise multiple red color block layers respectively arranged on multiple ones of the micro light-emitting diodes and multiple green color block layers respectively arranged on multiple ones of the micro light-emitting diodes, wherein the heat dissipation layers arranged between the red color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer; and the heat dissipation layers arranged between the green color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer. ### Claim 6 (depends on 4) The display panel according to claim 4, wherein the color block layers comprise multiple red color block layers respectively arranged on multiple ones of the micro light-emitting diodes and multiple green color block layers respectively arranged on multiple ones of the micro light-emitting diodes, wherein the heat dissipation layers arranged between the red color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer; and the heat dissipation layers arranged between the green color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer. ### Claim 7 (depends on 1) The micro light-emitting diode array substrate according to claim 1, wherein the color block layers are each made of a material containing quantum dots. ### Claim 8 (depends on 7) The micro light-emitting diode array substrate according to claim 7, wherein the color block layers comprise multiple red color block layers respectively arranged on multiple ones of the micro light-emitting diodes and multiple green color block layers respectively arranged on multiple ones of the micro light-emitting diodes, wherein the heat dissipation layers arranged between the red color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer; and the heat dissipation layers arranged between the green color block layers and the micro light-emitting diodes are connected to each other to form a unitary combined layer.