# US 10,503,064 B2 · Method for manufacturing color filter substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,503,064 B2 - Document ID: US10503064B2 - Status: Granted - Kind: B2 - Application number: 15/576,711 - Filed: 2017-11-09 - Published: 2019-03-21 - Granted: 2019-12-10 - Earliest claimed: 2017-09-15 - Assignees: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Applicants: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Wenjie Li; Shinsuke Iguchi - Web page: https://patentgrep.com/patent/US10503064B2 ## CPC - H10K 59/38: comprising colour filters or colour changing media [CCM] - G02F 1/133512: {Light shielding layers, e.g. black matrix (G02F1/136209 takes precedence)} - G02F 1/133516: {Methods for their manufacture, e.g. printing, electro-deposition or photolithography} - G02F 1/13394: {spacers regularly patterned on the cell subtrate, e.g. walls, pillars (G02F1/133377 takes precedence)} - G03F 7/0007: {Filters, e.g. additive colour filters; Components for display devices} - G03F 7/16: Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) - H10K 59/87: {Passivation; Containers; Encapsulations} - G02B 5/201: {in the form of arrays} - G02F 1/13398: {Spacer materials; Spacer properties} - G03F 7/105: having substances, e.g. indicators, for forming visible images - H10K 59/8792: {comprising light absorbing layers, e.g. black layers} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract A method for manufacturing a color filter substrate is provided in the present disclosure, that includes providing a substrate; forming a plurality of RGB color resists on the substrate, an upper surface of each of the RGB color resists forming a plurality of light emitting regions; forming a black matrix on the surface of each of the RGB color resists, wherein the black matrix covers a portion of the surface of each of the RGB color resists except the light emitting regions; forming a plurality of photo spacers on a surface of the black matrix in a plurality of empty areas within each of the RGB color resists, wherein the adjacent photo spacers are separated by one of the color resist regions; and forming a protective layer over the substrate. ## Claims ### Claim 1 A method for manufacturing a color filter substrate, comprising: a step S10 of providing a substrate; a step S20 of forming a plurality of RGB color resists on the substrate, wherein each of the RGB color resists comprises at least four color resist regions arranged in an array, each of the color resist regions comprises a first color resist block, a second color resist block, and a third color resist block distributed in sequence, an upper surface of each of the RGB color resists comprises a plurality of light emitting regions, wherein the first color resist block is a red color resist block, the second color resist block is a green color resist block, the third color resist block is a blue color resist block; a step S30 of forming a black matrix on the surface of each of the RGB color resists, wherein the black matrix covers a portion of the surface of each of the RGB color resists except the light emitting regions; a step S40 of forming a plurality of photo spacers on a surface of the black matrix in a plurality of empty areas within each of the RGB color resists, wherein the adjacent photo spacers are separated by one of the color resist regions; and a step S50 of forming a protective layer over the substrate, wherein the protective layer fully covers the black matrix, the photo spacers, and the RGB color resists; wherein a complementary arrangement of the photo spacers combined with the black matrix is configured to prevent light emitted from the RGB color resists from being mixed. ### Claim 2 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein the substrate is a rigid substrate or a flexible substrate. ### Claim 3 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein the material of the black matrix is one of organic photoresist, opaque metal, metal oxide, and metal nitride. ### Claim 4 (depends on 3) The method for manufacturing the color filter substrate as claimed in claim 3, wherein the material of the black matrix is organic photoresist, wherein the black matrix is formed by disposing the organic photoresist on the portion of the surface of each of the RGB color resists except the light emitting regions using nozzle printing technology or ink-jet printing technology. ### Claim 5 (depends on 3) The method for manufacturing the color filter substrate as claimed in claim 3, wherein the material of the black matrix is opaque metal or metal oxide, wherein the black matrix is formed by disposing the opaque metal or the metal oxide on the portion of the surface of each of the RGB color resists except the light emitting regions using thermal evaporation technology or magnetron sputtering technology. ### Claim 6 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein a length of the photo spacers is the same as a length of each of the RGB color resists. ### Claim 7 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein the material of the photo spacers is one of black frame sealant, opaque metal, metal oxide, metal nitride, and transparent organic light emitting diode (OLED) packaging frame sealant. ### Claim 8 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein the material of the photo spacers is organic photoresist, wherein the photo spacers are formed by disposing the organic photoresist on the surface of the black matrix in the empty areas within each of the RGB color resists using nozzle printing technology or ink-jet printing technology. ### Claim 9 (depends on 1) The method for manufacturing the color filter substrate as claimed in claim 1, wherein the photo spacers are formed by coating organic solvent, wherein the photo spacers are formed by curing the organic solvent while the organic solvent is coated. ### Claim 10 A method for manufacturing a color filter substrate, comprising: a step S10, providing a substrate; a step S20, forming a plurality of RGB color resists on the substrate, wherein each of the RGB color resists comprises at least four color resist regions in an array distribution, each of the color resist regions comprises a first color resist block, a second color resist block, and a third color resist block distributed in sequence, an upper surface of the RGB color resist comprises a plurality of light emitting regions; a step S30, forming a black matrix on the surface of each of the RGB color resists, wherein the black matrix covers a portion of the surface of each of the RGB color resists except the light emitting regions; a step S40, forming a plurality of photo spacers on a surface of the black matrix in a plurality of empty areas within each of the RGB color resists, wherein the adjacent photo spacers are separated by one of the color resist regions; and a step S50, forming a protective layer over the substrate, wherein the protective layer fully covers the black matrix, the photo spacers, and the RGB color resists; wherein a complementary arrangement of the photo spacers combined with the black matrix is configured to prevent light emitted from the RGB color resists from being mixed. ### Claim 11 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein the substrate is a rigid substrate or a flexible substrate. ### Claim 12 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein the material of the black matrix is one of organic photoresist, opaque metal, metal oxide, and metal nitride. ### Claim 13 (depends on 12) The method for manufacturing the color filter substrate as claimed in claim 12, wherein the material of the black matrix is organic photoresist, wherein the black matrix is formed by disposing the organic photoresist on the portion of the surface of each of the RGB color resists except the light emitting regions by adopting nozzle printing technology or ink-jet printing technology. ### Claim 14 (depends on 12) The method for manufacturing the color filter substrate as claimed in claim 12, wherein the material of the black matrix is opaque metal or metal oxide, wherein the black matrix is formed by disposing the opaque metal or the metal oxide on the portion of the surface of each of the RGB color resists except the light emitting regions using thermal evaporation technology or magnetron sputtering technology. ### Claim 15 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein a length of the photo spacers is the same as a length of each of the RGB color resist. ### Claim 16 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein the material of the photo spacers is one of black frame sealant, opaque metal, metal oxide, metal nitride, and transparent organic light emitting diode (OLED) packaging frame sealant. ### Claim 17 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein the material of the photo spacers is organic photoresist, wherein the photo spacers are formed by disposing the organic photoresist on the surface of the black matrix in the empty areas within each of the RGB color resists using nozzle printing technology or ink-jet printing technology. ### Claim 18 (depends on 10) The method for manufacturing the color filter substrate as claimed in claim 10, wherein the photo spacers are formed by coating organic solvent, wherein the photo spacers are formed by curing the organic solvent while the organic solvent is coated.