# US 10,502,775 B2 · Testing equipment for semiconductor element and its carrying device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,502,775 B2 - Document ID: US10502775B2 - Status: Granted - Kind: B2 - Application number: 15/814,415 - Filed: 2017-11-16 - Published: 2019-02-28 - Granted: 2019-12-10 - Earliest claimed: 2017-08-29 - Assignees: Global Unichip Corporation; Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Global Unichip Corporation; Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Chih-Chieh Liao; Yu-Min Sun; Chih-Feng Cheng - Web page: https://patentgrep.com/patent/US10502775B2 ## CPC - G01R 31/2601: {Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence)} - G01R 31/2875: {related to heating} - G01R 31/2877: {related to cooling} - H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)} - H10P 72/0602: {Temperature monitoring} - H10P 72/10: using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K). ## Claims ### Claim 1 A carrying device, comprising: a main body comprising a moving arm and a pressing portion connected to one end of the moving arm; a grasping portion connected to the main body and disposed on one end of the pressing portion opposite to the moving arm, for grasping a semiconductor element; a heat-exchanging module disposed on the main body, and disposed in the moving arm; and a gas chamber device, comprising: a case body disposed between the grasping portion and the heat-exchanging module, and disposed in the pressing portion and the moving arm, wherein the case body has a closed chamber therein; and a gas filling the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, wherein a specific heat capacity of the gas is substantially in a range from 5000 J/(kg·K) to 15000 J/(kg·K). ### Claim 2 (depends on 1) The carrying device of claim 1, wherein the gas is one of hydrogen and helium. ### Claim 3 (depends on 1) The carrying device of claim 1, wherein a surface of the case body opposite to the grasping portion is provided with a heat-sink fin array which thermally contacts the heat-exchanging module. ### Claim 4 (depends on 3) The carrying device of claim 3, wherein the heat-sink fin array comprises a plurality of fin members, wherein each of the fin members is solid; or each of the fin members is hollow and has a subspace therein belonging to a portion of the closed chamber. ### Claim 5 (depends on 3) The carrying device of claim 3, wherein one end of the moving arm facing towards the pressing portion is provided with an inserted slot that is thermally connected to the heat-exchanging module, wherein the heat-sink fin array is pluggably disposed within the inserted slot. ### Claim 6 (depends on 3) The carrying device of claim 3, wherein the heat-exchanging module comprises a fluid inlet, a fluid outlet and a fluid passage, and the fluid passage is disposed on the main body and is in communication with the fluid inlet and the fluid outlet. ### Claim 7 (depends on 6) The carrying device of claim 6, wherein the fluid passage is provided with a flowing channel therein that is in communication with the fluid inlet and the fluid outlet, and the heat-sink fin array is disposed within the flowing channel, and the surface of the case body of the gas chamber device which is opposite to the grasping portion tightly covers the flowing channel. ### Claim 8 (depends on 1) The carrying device of claim 1, wherein the grasping portion comprises: at least one vacuum device disposed in the main body, wherein the case body is formed in a ring shape, and the case body surrounds and defines a through hole which is isolated from the gas filling the closed chamber, and the vacuum device adsorbs the semiconductor element through the through hole. ### Claim 9 (depends on 1) The carrying device of claim 1, wherein the grasping portion comprises: a plurality of vacuum devices arranged at intervals in the main body for adsorbing the semiconductor element, wherein the vacuum devices define an area, and the case body is completely disposed in the area. ### Claim 10 (depends on 1) A testing equipment comprising: a circuit board; a test socket that is disposed on and connected to the circuit board; and a carrying device of claim 1 for carrying the semiconductor element and pressing against the semiconductor element onto the test socket, and electrically connecting the semiconductor element to the circuit board through the test socket.