# US 10,502,639 B2 · Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,502,639 B2 - Document ID: US10502639B2 - Status: Granted - Kind: B2 - Application number: 14/239,352 - Filed: 2012-08-22 - Published: 2014-07-24 - Granted: 2019-12-10 - Earliest claimed: 2011-08-26 - Assignees: Sumitomo Osaka Cement Co., Ltd. - Applicants: Mamoru Kosakai; Kazunori Ishimura; Takeshi Watanabe; Hitoshi Kouno; Ryuuji Hayahara - Inventors: Mamoru Kosakai; Kazunori Ishimura; Takeshi Watanabe; Hitoshi Kouno; Ryuuji Hayahara - Web page: https://patentgrep.com/patent/US10502639B2 ## CPC - G01K 13/00: Thermometers specially adapted for specific purposes - H05B 1/0233: {for semiconductors manufacturing} - H05B 3/265: {the insulating base being an inorganic material, e.g. ceramic (H05B3/262 takes precedence)} - H10P 72/0602: {Temperature monitoring} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H05B 2203/002: Heaters using a particular layout for the resistive material or resistive elements - H10P 72/722: {Details of electrostatic chucks} - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature. In such plate-shaped body for temperature measurement (1), an insulating adhesive (3) is bonded to the entirety of a surface (2a) of a wafer (2), a heater element (4) is provided on the insulating adhesive (3), a temperature measurement region (5) is provided used to measure the temperature of the surface (2a) of the wafer (2) in a region excluding the heater element (4) on the surface (3a) of the insulating adhesive (3), and the heater element (4) and the temperature measurement region (5) are coated with an insulating film (6). ## Claims ### Claim 1 A temperature measurement plate, comprising: a wafer having an insulating adhesive on one main surface of the wafer; a heating member on the insulating adhesive; a plurality of temperature measurement regions provided on the insulating adhesive; and an insulating film covering the heating member and the plurality of temperature measurement regions, wherein the insulating adhesive includes any one type of an acrylic-based adhesive, and epoxy-based adhesive, and a polyimide amide-based adhesive, the insulating film is formed of polytetrafluoroethylene, polyimide, or polyamide, and the plurality of temperature measurement regions are arrayed in one row at predetermined intervals from each other and are connected with each other. ### Claim 2 (depends on 1) The temperature measurement plate according to claim 1, wherein the heating member is a metal foil. ### Claim 3 (depends on 1, 2) The temperature measurement plate according to claim 1 or 2, wherein the wafer is formed of any one type of silicon, silicon carbide, silicon nitride, III-V group compound semiconductors, and II-VI group compound semiconductors. ### Claim 4 (depends on 2) The temperature measurement plate according to claim 2, wherein the metal foil is formed of titanium, tantalum, or molybdenum. ### Claim 5 (depends on 1) The temperature measurement plate according to claim 1, wherein the insulating adhesive is bonded to an entire surface of the wafer, and the heating member has a meandering shape. ### Claim 6 (depends on 5) The temperature measurement plate according to claim 5, wherein the plurality of the temperature measurement regions are connected with each other in one row between meandering portions of the meandering shape. ### Claim 7 (depends on 1) The temperature measurement plate according to claim 1, further comprising voltage application electrodes provided at opposite ends of the heating member. ### Claim 8 (depends on 1) The temperature measurement plate according to claim 1, wherein the plurality of temperature measurement regions are arrayed in a cross shape. ### Claim 9 (depends on 8) The temperature measurement plate according to claim 8, wherein the cross shape intersects at a center portion of the wafer. ### Claim 10 (depends on 1) The temperature measurement plate according to claim 1, wherein the insulating film has an infrared transmittance of 80% or less. ### Claim 11 (depends on 1) The temperature measurement plate according to claim 1, wherein each of the plurality of temperature measurement regions is a region with a circular shape having a diameter of 2 mm to 15 mm. ### Claim 12 A temperature measuring apparatus comprising: a temperature measurement plate comprising: a wafer having an insulating adhesive on one main surface of the wafer; a heating member on the insulating adhesive; a plurality of temperature measurement regions provided on the insulating adhesive; and an insulating film covering the heating member and the plurality of temperature measurement regions; an electrostatic chuck apparatus comprising: an electrostatic chuck section having a mounting surface; and a cooling base section; a thermograph; and a sealed container compromising a ceiling plate having a window, wherein the insulating adhesive includes any one type of an acrylic-based adhesive, an epoxy-based adhesive, and a polyimide amide-based adhesive, the insulating film is formed of polytetrafluoroethylene, polyimide, or polyamide, the wafer is configured to be mountable on the mounting surface such that the temperature measurement regions face the thermograph via the insulating film and to be removable from the mounting surface, the electrostatic chuck apparatus is stored in a bottom section of the sealed container, the thermograph is provided outside the ceiling plate and faces the electrostatic chuck apparatus via the window, and the plurality of temperature measurement regions are arrayed in one row at predetermined intervals from each other and are connected with each other.